SBOS545D February   2011  – December 2018 TMP103

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 One-Shot Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1  Temperature Watchdog Function
      2. 7.5.2  Conversion Rate
      3. 7.5.3  Shutdown Mode (M1 = 0, M0 = 0)
      4. 7.5.4  One-Shot (M1 = 0, M0 = 1)
      5. 7.5.5  Continuous Conversion Mode (M1 = 1)
      6. 7.5.6  Bus Overview
      7. 7.5.7  Serial Interface
      8. 7.5.8  Serial Bus Address
      9. 7.5.9  Writing and Reading Operation
      10. 7.5.10 Slave Mode Operations
        1. 7.5.10.1 Slave Receiver Mode
        2. 7.5.10.2 Slave Transmitter Mode
      11. 7.5.11 General Call
      12. 7.5.12 High-Speed (Hs) Mode
      13. 7.5.13 Timeout Function
      14. 7.5.14 Multiple Device Access
        1. 7.5.14.1 Multiple Device Access Write
        2. 7.5.14.2 Multiple Device Access Read
      15. 7.5.15 NOISE
    6. 7.6 Register Maps
      1. 7.6.1 Pointer Register
      2. 7.6.2 Temperature Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Temperature Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The TMP103 is a digital output temperature sensor in a wafer chip-scale package (WCSP) that is optimal for thermal management and thermal profiling. The TMP103 includes a two-wire interface that is compatible with both I2C and SMBus interfaces. In addition, the TMP103 has the capability of executing multiple device access (MDA) commands that allow multiple TMP103 devices to respond to a single global bus command. MDA commands reduce communication time and power in a bus that contains multiple TMP103 devices. The TMP103 is specified over a temperature range of –40ºC to 125ºC.

The TMP103 serial interface is designed to support up to eight TMP103 devices on a single bus. The TMP103 is offered with eight internal interface addresses. Each unique address option can be used as a location or temperature zone designator. The TMP103 responds to standard I2C and SMBus slave protocols that allow the internal registers to be written to or read from on an individual basis. The TMP103 also responds to MDA commands that allow all the devices on the bus to be written to or read from, without having to send the individual address and commands to each device.

Pullup resistors are required on SCL and SDA. TI also recommends a 0.01-μF bypass capacitor, as shown in Figure 11.

TMP103 ai_typ_conn_bos545.gif
NOTE: SCL and SDA pins require pullup resistors.
Figure 11. Typical Connections

The temperature sensor in the TMP103 is the chip itself. Thermal paths run through the package bumps as well as the package. The lower thermal resistance of metal causes the bumps to provide the primary thermal path.

To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate the package from ambient air temperature.