SBOS564B November   2011  – December 2018 TMP104

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Typical Application
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Timeout Function
      2. 7.2.2 Noise
      3. 7.2.3 SMAART Wire™ Interface Timing Specifications
    3. 7.3 Programming
      1. 7.3.1 Communication Protocol
      2. 7.3.2 Command Register
      3. 7.3.3 Global Initialization and Address Assignment Sequence
      4. 7.3.4 Global Read and Write
      5. 7.3.5 Global Clear Interrupt
      6. 7.3.6 Global Software Reset
      7. 7.3.7 Individual Read and Write
    4. 7.4 Register Maps
      1. 7.4.1 Temperature Register
      2. 7.4.2 Configuration Register
        1. 7.4.2.1 Temperature Watchdog Function (FH, FL)
        2. 7.4.2.2 Conversion Rate (CR1, CR0)
        3. 7.4.2.3 Conversion Modes
          1. 7.4.2.3.1 Shutdown Mode (M1 = 0, M0 = 0)
          2. 7.4.2.3.2 One-Shot Mode (M1 = 0, M0 = 1)
          3. 7.4.2.3.3 Continuous Conversion Mode (M1 = 1)
        4. 7.4.2.4 Interrupt Functionality (INT_EN)
      3. 7.4.3 Temperature Limit Registers
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.