SBOS564B November   2011  – December 2018 TMP104

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Typical Application
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Timeout Function
      2. 7.2.2 Noise
      3. 7.2.3 SMAART Wire™ Interface Timing Specifications
    3. 7.3 Programming
      1. 7.3.1 Communication Protocol
      2. 7.3.2 Command Register
      3. 7.3.3 Global Initialization and Address Assignment Sequence
      4. 7.3.4 Global Read and Write
      5. 7.3.5 Global Clear Interrupt
      6. 7.3.6 Global Software Reset
      7. 7.3.7 Individual Read and Write
    4. 7.4 Register Maps
      1. 7.4.1 Temperature Register
      2. 7.4.2 Configuration Register
        1. 7.4.2.1 Temperature Watchdog Function (FH, FL)
        2. 7.4.2.2 Conversion Rate (CR1, CR0)
        3. 7.4.2.3 Conversion Modes
          1. 7.4.2.3.1 Shutdown Mode (M1 = 0, M0 = 0)
          2. 7.4.2.3.2 One-Shot Mode (M1 = 0, M0 = 1)
          3. 7.4.2.3.3 Continuous Conversion Mode (M1 = 1)
        4. 7.4.2.4 Interrupt Functionality (INT_EN)
      3. 7.4.3 Temperature Limit Registers
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) TMP104 UNIT
YFF (DSBGA)
4 PINS
RθJA Junction-to-ambient thermal resistance 188.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 2.1 °C/W
RθJB Junction-to-board thermal resistance 35.1 °C/W
ψJT Junction-to-top characterization parameter 10.6 °C/W
ψJB Junction-to-board characterization parameter 35.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).