SBOS854F
March 2018 – June 2024
TMP1075
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics:TMP1075
6.6
Electrical Characteristics: TMP1075N
6.7
Timing Requirements:TMP1075
6.8
Timing Requirements: TMP1075N
6.9
Switching Characteristics
6.10
Timing Diagrams
6.11
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Digital Temperature Output
7.3.2
I2C and SMBus Serial Interface
7.3.2.1
Bus Overview
7.3.2.2
Serial Bus Address
7.3.2.3
Pointer Register
7.3.2.3.1
Pointer Register Byte [reset = 00h]
7.3.2.4
Writing and Reading to the TMP1075
7.3.2.5
Operation Mode
7.3.2.5.1
Receiver Mode
7.3.2.5.2
Transmitter Mode
7.3.2.6
SMBus Alert Function
7.3.2.7
General Call- Reset Function
7.3.2.8
High-Speed Mode (HS)
7.3.2.9
Coexists in I3C Mixed Fast Mode
7.3.2.10
Time-Out Function
7.3.3
Timing Diagrams
7.3.4
Two-Wire Timing Diagrams
7.4
Device Functional Modes
7.4.1
Shutdown Mode (SD)
7.4.2
One-Shot Mode (OS)
7.4.3
Continuous Conversion Mode (CC)
7.4.4
Thermostat Mode (TM)
7.4.4.1
Comparator Mode (TM = 0)
7.4.4.2
Interrupt Mode (TM = 1)
7.4.4.3
Polarity Mode (POL)
7.5
Register Map
7.5.1
Register Descriptions
7.5.1.1
Temperature Register (address = 00h) [default reset = 0000h]
7.5.1.2
Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
7.5.1.3
Low Limit Register (address = 02h) [default reset = 4B00h]
7.5.1.4
High Limit Register (address = 03h) [default reset = 5000h]
7.5.1.5
Device ID Register (address = 0Fh) [default reset = 7500]
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Migrating From the xx75 Device Family
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DSG|8
MPDS308C
DGK|8
MPDS028E
DRL|6
MPDS159H
Thermal pad, mechanical data (Package|Pins)
DSG|8
QFND141I
Orderable Information
sbos854f_oa
sbos854f_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.