SLOS887F September   2014  – June 2022 TMP112-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Specifications for User-Calibrated Systems
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Temperature Output
      2. 8.3.2 Serial Interface
        1. 8.3.2.1 Bus Overview
        2. 8.3.2.2 Serial Bus Address
        3. 8.3.2.3 Writing and Reading Operation
        4. 8.3.2.4 Target Mode Operation
          1. 8.3.2.4.1 Target Receiver Mode
          2. 8.3.2.4.2 Target Transmitter Mode
        5. 8.3.2.5 SMBus Alert Function
        6. 8.3.2.6 General Call
        7. 8.3.2.7 High-Speed (Hs) Mode
        8. 8.3.2.8 Timeout Function
        9. 8.3.2.9 Timing Diagrams
          1. 8.3.2.9.1 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous-Conversion Mode
      2. 8.4.2 Extended Mode (EM)
      3. 8.4.3 Shutdown Mode (SD)
      4. 8.4.4 One-Shot and Conversion Ready Mode (OS)
      5. 8.4.5 Thermostat Mode (TM)
        1. 8.4.5.1 Comparator Mode (TM = 0)
        2. 8.4.5.2 Interrupt Mode (TM = 1)
    5. 8.5 Programming
      1. 8.5.1 Pointer Register
      2. 8.5.2 Temperature Register
      3. 8.5.3 Configuration Register
        1. 8.5.3.1 Shutdown Mode (SD)
        2. 8.5.3.2 Thermostat Mode (TM)
        3. 8.5.3.3 Polarity (POL)
        4. 8.5.3.4 Fault Queue (F1/F0)
        5. 8.5.3.5 Converter Resolution (R1 and R0)
        6. 8.5.3.6 One-Shot (OS)
        7. 8.5.3.7 Extended Mode (EM)
        8. 8.5.3.8 Alert (AL)
        9. 8.5.3.9 Conversion Rate (CR)
      4. 8.5.4 High- and Low-Limit Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Calibrating for Improved Accuracy
        1. 9.1.1.1 Example 1: Finding Worst-Case Accuracy From –15°C to 50°C
        2. 9.1.1.2 Example 2: Finding Worst-Case Accuracy From 25°C to 100°C
      2. 9.1.2 Using The Slope Specifications With a 1-Point Calibration
        1. 9.1.2.1 Power Supply-Level Contribution to Accuracy
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TMP112-Q1UNIT
DRL (SOT563)
6 PINS
RθJAJunction-to-ambient thermal resistance210.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance105.0°C/W
RθJBJunction-to-board thermal resistance87.5°C/W
ψJTJunction-to-top characterization parameter6.1°C/W
ψJBJunction-to-board characterization parameter87.0°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.