SBOS740A May   2017  – May 2019 TMP116

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Temperature Accuracy
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Conversions
        1. 7.4.1.1 Conversion Cycle
        2. 7.4.1.2 Averaging
        3. 7.4.1.3 Continuous Conversion Mode (CC)
        4. 7.4.1.4 Shutdown Mode (SD)
        5. 7.4.1.5 One-Shot Mode (OS)
      2. 7.4.2 Therm and Alert Modes
        1. 7.4.2.1 Alert Mode
        2. 7.4.2.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Registers Map
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  Temperature Register (address = 00h) [default reset = 8000h]
          1. Table 5. Temperature Register Field Descriptions
        2. 7.6.1.2  Configuration Register (address = 01h) [Factory default reset = 0220h]
          1. Table 6. Configuration Register Field Descriptions
        3. 7.6.1.3  High Limit Register (address = 02h) [Factory default reset = 6000h]
          1. Table 8. High Limit Register Field Descriptions
        4. 7.6.1.4  Low Limit Register (address = 03h) [Factory default reset = 8000h]
          1. Table 9. Low Limit Register Field Descriptions
        5. 7.6.1.5  EEPROM Unlock Register (address = 04h) [reset = 0000h]
          1. Table 10. EEPROM Unlock Register Field Descriptions
        6. 7.6.1.6  EEPROM1 Register (address = 05h) [reset = XXXXh]
          1. Table 11. EEPROM1 Register Field Descriptions
        7. 7.6.1.7  EEPROM2 Register (address = 06h) [reset = XXXXh]
          1. Table 12. EEPROM2 Register Field Descriptions
        8. 7.6.1.8  EEPROM3 Register (address = 07h) [reset = 0000h]
          1. Table 13. EEPROM3 Register Field Descriptions
        9. 7.6.1.9  EEPROM4 Register (address = 08h) [reset = XXXXh]
          1. Table 14. EEPROM4 Register Field Descriptions
        10. 7.6.1.10 Device ID Register (address = 0Fh) [reset = 1116h]
          1. Table 15. Device ID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Noise and Averaging
          2. 8.1.1.2.2 Self-Heating Effect (SHE)
          3. 8.1.1.2.3 Synchronized Temperature Measurements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1.2 Averaging

Noise in the conversion result can be reduced by configuring the device to report the average of multiple temperature conversions using the AVG[1:0] bits. When the TMP116 is configured to perform averaging, the device executes the configured number of conversions while accumulating the results and reports the average of all conversion results at the end of the process. As illustrated in the noise histograms of Figure 6 and Figure 7, the temperature result output has a repeatability of approximately ±3 LSBs when there is no averaging and ±1 LSB when the device is configured to perform eight averages or higher. As illustrated in Figure 20, this improvement in noise performance is achieved with the tradeoff of an increase in the active conversion time in a conversion cycle, thereby increasing the average active current consumption. For example, a single active conversion typically takes 15.5 ms so if the device is configured to report an average of eight conversions then the active conversion time is 124 ms (15.5 ms × 8). Use Equation 1 to factor in this increase in active conversion time to accurately calculate the average current consumption of the device. The average current consumption of the device can be decreased by increasing the amount of time the device spends in standby period as compared to active conversion. Under the factory EEPROM settings, the device is configured to report an average of eight conversions with a conversion cycle time of 1 second.

TMP116 TMP116N ai_averaging_sbos740.gifFigure 20. Averaging Timing Diagram

Use Equation 1 to calculate the average current consumption of the device in continuous mode.

Equation 1. TMP116 TMP116N q_conv_cycle_sbos740.gif