SBOS740A May   2017  – May 2019 TMP116

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Temperature Accuracy
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Conversions
        1. 7.4.1.1 Conversion Cycle
        2. 7.4.1.2 Averaging
        3. 7.4.1.3 Continuous Conversion Mode (CC)
        4. 7.4.1.4 Shutdown Mode (SD)
        5. 7.4.1.5 One-Shot Mode (OS)
      2. 7.4.2 Therm and Alert Modes
        1. 7.4.2.1 Alert Mode
        2. 7.4.2.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Registers Map
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  Temperature Register (address = 00h) [default reset = 8000h]
          1. Table 5. Temperature Register Field Descriptions
        2. 7.6.1.2  Configuration Register (address = 01h) [Factory default reset = 0220h]
          1. Table 6. Configuration Register Field Descriptions
        3. 7.6.1.3  High Limit Register (address = 02h) [Factory default reset = 6000h]
          1. Table 8. High Limit Register Field Descriptions
        4. 7.6.1.4  Low Limit Register (address = 03h) [Factory default reset = 8000h]
          1. Table 9. Low Limit Register Field Descriptions
        5. 7.6.1.5  EEPROM Unlock Register (address = 04h) [reset = 0000h]
          1. Table 10. EEPROM Unlock Register Field Descriptions
        6. 7.6.1.6  EEPROM1 Register (address = 05h) [reset = XXXXh]
          1. Table 11. EEPROM1 Register Field Descriptions
        7. 7.6.1.7  EEPROM2 Register (address = 06h) [reset = XXXXh]
          1. Table 12. EEPROM2 Register Field Descriptions
        8. 7.6.1.8  EEPROM3 Register (address = 07h) [reset = 0000h]
          1. Table 13. EEPROM3 Register Field Descriptions
        9. 7.6.1.9  EEPROM4 Register (address = 08h) [reset = XXXXh]
          1. Table 14. EEPROM4 Register Field Descriptions
        10. 7.6.1.10 Device ID Register (address = 0Fh) [reset = 1116h]
          1. Table 15. Device ID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Noise and Averaging
          2. 8.1.1.2.2 Self-Heating Effect (SHE)
          3. 8.1.1.2.3 Synchronized Temperature Measurements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1.2 Programming the EEPROM

To prevent accidental programming, the EEPROM is locked by default. When locked, any I2C writes to the register map locations are performed only on the volatile registers and not on the EEPROM.

Figure 25 illustrates a flow chart describing the EEPROM programming sequence. To program the EEPROM, first unlock the EEPROM by setting the EUN bit in the EEPROM unlock register. After the EEPROM is unlocked, any subsequent I2C writes to the register map locations program a corresponding non-volatile memory location in the EEPROM. Programming a single location typically takes 7 ms to complete and consumes 230 µA. Do not perform any I2C writes until programming is completed. During programming, the EEPROM_busy flag is set. Read this flag to monitor if the programming is complete. After programming the desired data, issue a general-call reset command to trigger a software reset. The programmed data from the EEPROM are then loaded to the corresponding register map locations as part of the reset sequence. This command also clears the EUN bit and automatically locks the EEPROM to prevent any further accidental programming. The application must avoid temperature conversions when the EEPROM is unlocked.

TMP116 TMP116N flowchart_eeprom_tmp116.gifFigure 25. EEPROM Programming Sequence