SNOSD82D June   2018  – September 2022 TMP117

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Two-Wire Interface Timing
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode (SD)
      3. 7.4.3 One-Shot Mode (OS)
      4. 7.4.4 Therm and Alert Modes
        1. 7.4.4.1 Alert Mode
        2. 7.4.4.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Register Map
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Noise and Averaging
        2. 8.2.2.2 Self-Heating Effect (SHE)
        3. 8.2.2.3 Synchronized Temperature Measurements
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRV|6
  • YBG|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TMP117 is a high-precision digital temperature sensor. It is designed to meet ASTM E1112 and ISO 80601 requirements for electronic patient thermometers. The TMP117 provides a 16-bit temperature result with a resolution of 0.0078 °C and an accuracy of up to ±0.1 °C across the temperature range of –20 °C to 50 °C with no calibration. The TMP117 has in interface that is I2C- and SMBus™-compatible, programmable alert functionality, and the device can support up to four devices on a single bus. Integrated EEPROM is included for device programming with an additional 48-bits memory available for general use.

The low power consumption of the TMP117 minimizes the impact of self-heating on measurement accuracy. The TMP117 operates from 1.7 V to 5.5 V and typically consumes 3.5 μA.

For non-medical applications, the TMP117 can serve as a single chip digital alternative to a Platinum RTD. The TMP117 has an accuracy comparable to a Class AA RTD, while only using a fraction of the power of the power typically needed for a PT100 RTD. The TMP117 simplifies the design effort by removing many of the complexities of RTDs such as precision references, matched traces, complicated algorithms, and calibration.

The TMP117 units are 100% tested on a production setup that is NIST traceable and verified with equipment that is calibrated to ISO/IEC 17025 accredited standards.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TMP117 WSON (6) 2.00 mm × 2.00 mm
DSBGA (6) 1.53 mm × 1.00 mm
For all available packages, see the package option addendum at the end of the data sheet.
GUID-3C752076-7AF5-4879-A4E4-CFB129129067-low.gifYBG Temperature Accuracy
GUID-369FEF61-D5F2-4CCC-8B79-1E9A2E3D2EF1-low.gifDRV Temperature Accuracy