SNIS227C May   2021  – June 2022 TMP126-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Descriptions
      1. 8.3.1 Temperature Limits
      2. 8.3.2 Slew Rate Warning
      3. 8.3.3 Cyclic Redundancy Check (CRC)
      4. 8.3.4 NIST Traceability
      5. 8.3.5 Fast Measurement Intervals With No Self-Heating Concerns
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 One-Shot Mode
      4. 8.4.4 Interrupt and Comparator Mode
        1. 8.4.4.1 Interrupt Mode
        2. 8.4.4.2 Comparator Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 Serial Bus Interface
        1. 8.5.2.1 Command Word Structure
          1. 8.5.2.1.1 Don't Care
          2. 8.5.2.1.2 CRC Enable
          3. 8.5.2.1.3 CRC Data Block Length
          4. 8.5.2.1.4 Auto Increment
          5. 8.5.2.1.5 Read/Write
          6. 8.5.2.1.6 Sub-Address
        2. 8.5.2.2 Communication
        3. 8.5.2.3 Write Operations
        4. 8.5.2.4 Read Operations
        5. 8.5.2.5 Cyclic Redundancy Check (CRC)
          1. 8.5.2.5.1 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.