SNIS227C May   2021  – June 2022 TMP126-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Descriptions
      1. 8.3.1 Temperature Limits
      2. 8.3.2 Slew Rate Warning
      3. 8.3.3 Cyclic Redundancy Check (CRC)
      4. 8.3.4 NIST Traceability
      5. 8.3.5 Fast Measurement Intervals With No Self-Heating Concerns
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 One-Shot Mode
      4. 8.4.4 Interrupt and Comparator Mode
        1. 8.4.4.1 Interrupt Mode
        2. 8.4.4.2 Comparator Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 Serial Bus Interface
        1. 8.5.2.1 Command Word Structure
          1. 8.5.2.1.1 Don't Care
          2. 8.5.2.1.2 CRC Enable
          3. 8.5.2.1.3 CRC Data Block Length
          4. 8.5.2.1.4 Auto Increment
          5. 8.5.2.1.5 Read/Write
          6. 8.5.2.1.6 Sub-Address
        2. 8.5.2.2 Communication
        3. 8.5.2.3 Write Operations
        4. 8.5.2.4 Read Operations
        5. 8.5.2.5 Cyclic Redundancy Check (CRC)
          1. 8.5.2.5.1 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Over free-air temperature range and VDD = 1.62 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25 °C and VDD = 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
TERR(1) Temperature accuracy  20 °C to 30 °C -0.25 0.25 °C
-20 °C to 85 °C -0.3 0.3 °C
-40 °C to 125 °C -0.4 0.4 °C
-55 °C to 150 °C -0.5 0.5 °C
-55 °C to 175 °C -0.75 0.75 °C
PSR DC power supply rejection  One-shot mode 12.7 m°C/V
TRES Temperature resolution Including sign bit 14 Bits
LSB 31.25 m°C
TREPEAT Repeatability(2) VDD = 3.3 V
1-Hz conversion cycle		 ±1 LSB
TLTD Long-term stability and drift(3) 1000 hours at 175 °C 0.07 °C
tLIQUID  Response time (Stirred Liquid) DBV Package Single layer Flex PCB
0.2032 mm thickness		 τ = 63 %
25 °C to 75 °C		 0.8 s
2-layer FR4 PCB
1.5748 mm thickness		 1.8 s
tLIQUID Response time (Stirred Liquid) DCK Package Single layer Flex PCB
0.2032 mm thickness		 τ = 63 %
25 °C to 75 °C		 0.6 s
2-layer FR4 PCB
1.5748 mm thickness		 1.3 s
Temperature cycling and hysteresis(4) ±0.5 LSB
tCONV Active conversion time 4.5 6 7.5 ms
tVAR Timing variation Conversion Period
Slew Rate Result
Slew Rate Limit		 -15 15 %
DIGITAL INPUT/OUTPUT
CIN Input capacitance f = 1 MHz 20 pF
VIH Input logic high level SCLK, SIO, CS 0.7 * VDD VDD V
VIL Input logic low level SCLK, SIO, CS 0 0.3 * VDD V
IIN Input leakage current SCLK, SIO, CS -0.5 0.5 μA
VOH SIO output high level IOH = 3 mA VDD - 0.4  VDD V
VOL SIO output low level IOL = -3 mA 0 0.4 V
VOL ALERT output logic low level IOL = -3 mA 0 0.4 V
POWER SUPPLY
IDD_ACTIVE Supply current during active conversion CS = VDD TA = 25 °C 77 87 μA
TA = -55 °C to 150 °C 135
TA = 175 °C 160
IDD Average current consumption CS = VDD TA = 25 °C
Conversion cycle time: 1 Hz		 1 1.2 μA
TA = -55 °C to 150 °C
Conversion cycle time: 1 Hz		 16
TA = 175 °C
Conversion cycle time: 1 Hz		 35
ISB Standby current(5) CS = VDD TA = 25 °C 0.5 0.75 μA
TA = -55 °C to 150 °C 15
TA = -55 °C to 175 °C 34
ISD Shutdown current CS = VDD TA = 25 °C 0.35 0.5 μA
TA = -55 °C to 150 °C 15
TA = -55 °C to 175 °C 34
VPOR Power-on reset threshold voltage Supply rising 1.3 V
Brownout detect Supply falling 1.1 V
tRESET Reset Time Time required by device to reset 0.5 ms
(1) Temperature Accuracy (averaging on or averaging off) guaranteed in both continuous conversion mode and one-shot mode with a conversion period greater than or equal to 31.25 ms.
(2) Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
(3) Long term stability is determined using accelerated operational life testing at a junction temperature of 150 °C.
(4) Hysteresis is defined as the ability to reproduce a temperature reading as the temperature varies from room → hot →room→cold→room. The temperatures used for this test are -40 °C, 25 °C, and 150 °C.
(5) Quiescent current between conversions