SNIS209C July   2021  – June 2022 TMP126

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Descriptions
      1. 8.3.1 Temperature Limits
      2. 8.3.2 Slew Rate Warning
      3. 8.3.3 Cyclic Redundancy Check (CRC)
      4. 8.3.4 NIST Traceability
      5. 8.3.5 Fast Measurement Intervals With No Self-Heating Concerns
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 One-Shot Mode
      4. 8.4.4 Interrupt and Comparator Mode
        1. 8.4.4.1 Interrupt Mode
        2. 8.4.4.2 Comparator Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 Serial Bus Interface
        1. 8.5.2.1 Command Word Structure
          1. 8.5.2.1.1 Don't Care
          2. 8.5.2.1.2 CRC Enable
          3. 8.5.2.1.3 CRC Data Block Length
          4. 8.5.2.1.4 Auto Increment
          5. 8.5.2.1.5 Read/Write
          6. 8.5.2.1.6 Sub-Address
        2. 8.5.2.2 Communication
        3. 8.5.2.3 Write Operations
        4. 8.5.2.4 Read Operations
        5. 8.5.2.5 Cyclic Redundancy Check (CRC)
          1. 8.5.2.5.1 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TMP126 UNIT
DCK (SC70)
6 PINS
RθJA Junction-to-ambient thermal resistance 183.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 136.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
RθJB Junction-to-board thermal resistance 74.2 °C/W
ψJT Junction-to-top characterization parameter 57.9 °C/W
ψJB Junction-to-board characterization parameter 74.0 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.