SBOS891C October 2018 – September 2023 TMP144
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TMP144 | UNIT | |||
---|---|---|---|---|---|
YFF (DSBGA) | YMT (DSBGA) | YBK (DSBGA) | |||
4 PINS | 4 PINS | 4 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 188.5 | 167.3 | 180.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 2.1 | 0.7 | 1.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | NA | NA | °C/W |
RθJB | Junction-to-board thermal resistance | 35.1 | 47.0 | 60 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.6 | 0.4 | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 35.1 | 47.0 | 60 | °C/W |