SBOS939D April   2019  – June 2022 TMP235-Q1 , TMP236-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-82E58E65-D18D-484C-B353-F4002A002BEC-low.gifFigure 5-1 DBZ Package3-Pin SOT-23Top View
GUID-A58DAA51-FF33-440E-88F7-CC0210B85065-low.gif
NC- no internal connection
Figure 5-2 DCK Package5-Pin SC70Top View
Table 5-1 Pin Functions
NAME PIN TYPE DESCRIPTION
SOT-23 SC70
GND 3 2 Ground Power supply ground.
NC — 5 — No internal connection. This pin may be left floating or connected to GND.
NC — 1 — No internal connection. This pin may be left floating or connected to GND.
VOUT 2 3 O Outputs voltage proportional to temperature
VDD 1 4 I Positive supply input