SBOS760B November   2015  – April 2017 TMP275-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
      3. 7.3.3 Bus Overview
      4. 7.3.4 Serial Bus Address
        1. 7.3.4.1 Writing and Reading to the TMP275-Q1
        2. 7.3.4.2 Slave Mode Operations
          1. 7.3.4.2.1 Slave Receiver Mode
          2. 7.3.4.2.2 Slave Transmitter Mode
        3. 7.3.4.3 SMBus Alert Function
        4. 7.3.4.4 General Call
        5. 7.3.4.5 High-Speed Mode
        6. 7.3.4.6 Time-Out Function
      5. 7.3.5 Timing Diagrams
        1. 7.3.5.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 Thermostat Mode (TM)
        1. 7.4.2.1 Comparator Mode (TM = 0)
        2. 7.4.2.2 Interrupt Mode (TM = 1)
      3. 7.4.3 One-Shot (OS)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
      4. 7.5.4 Polarity (POL)
      5. 7.5.5 Fault Queue (F1/F0)
      6. 7.5.6 Converter Resolution (R1/R0)
      7. 7.5.7 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Connections of the TMP275-Q1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Connecting Multiple Devices on a Single Bus
      3. 8.2.3 Temperature Data Logger for Cold Chain Management Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply, V+ 7 V
Input voltage(2) –0.5 7 V
Input current 10 mA
Operating temperature –55 127 °C
Junction temperature, TJ max 150 °C
Storage temperature, Tstg –60 130 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input voltage rating applies to all TMP275-Q1 input voltages.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 2.7 5.5 V
Operating free-air temperature, TA –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP275-Q1 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 121.6 185 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.5 76.1 °C/W
RθJB Junction-to-board thermal resistance 62 106.4 °C/W
ψJT Junction-to-top characterization parameter 23 14.1 °C/W
ψJB Junction-to-board characterization parameter 61.5 104.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at TA = –40°C to +125°C and V+ = 2.7 V to 5.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Range –40 125 °C
Accuracy (temperature error) –10°C to 85°C, V+ = 3.3 V ±0.125 ±0.75 °C
0°C to 100°C, V+ = 3 V to 3.6 V ±0.125 ±1
–40°C to 125°C, V+ = 3 V to 3.6 V ±0.125 ±1.5
25°C to 100°C, V+ = 3.3 V to 5.5 V ±0.2 ±2
Resolution(1) Selectable 0.0625 °C
DIGITAL INPUT/OUTPUT
Input capacitance 3 pF
VIH High-level input logic 0.7 (V+) 6 V
VIL Low-level input logic –0.5 0.3 (V+) V
IIN Leakage input current 0 V ≤ VIN ≤ 6 V 1 µA
Input voltage hysteresis SCL and SDA pins 500 mV
VOL Low-level output logic SDA IOL = 3 mA 0 0.15 0.4 V
ALERT IOL = 4 mA 0 0.15 0.4
Resolution Selectable 9 to 12 Bits
Conversion time 9 bits 27.5 37.5 ms
10 bits 55 75
11 bits 110 150
12 bits 220 300
Time-out time 25 54 74 ms
POWER SUPPLY
Operating range 2.7 5.5 V
IQ Quiescent current Serial bus inactive 50 85 µA
Serial bus active, SCL frequency = 400 kHz 100
Serial bus active, SCL frequency = 3.4 MHz 410
ISD Shutdown current Serial bus inactive 0.1 3 µA
Serial bus active, SCL frequency = 400 kHz 60
Serial bus active, SCL frequency = 3.4 MHz 380
TEMPERATURE RANGE
Specified range –40 125 °C
Operating range –55 127 °C
(1) Specified for 12-bit resolution.

6.6 Timing Requirements

see the Timing Diagrams section for timing diagrams(1)
FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
ƒ(SCL) SCL operating frequency V+ 0.001 0.4 0.001 2.38 MHz
t(BUF) Bus-free time between STOP and START condition See the Timing Diagrams section 1300 160 ns
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.		 600 160 ns
t(SUSTA) repeated start condition setup time 600 160 ns
t(SUSTO) STOP condition setup time 600 160 ns
t(HDDAT) Data hold time 4 900 4 120 ns
t(SUDAT) Data setup time 100 10 ns
t(LOW) SCL-clock low period V+ , see the Timing Diagrams section 1300 280 ns
t(HIGH) SCL-clock high period See the Timing Diagrams section 600 60 ns
tFD Data fall time See the Timing Diagrams section 300 150 ns
tRC Clock rise time See the Two-Wire Timing Diagrams section 300 40 ns
SCLK ≤ 100 kHz, see the Timing Diagrams section 1000 ns
tFC Clock fall time See the Two-Wire Timing Diagrams section 300 40 ns
(1) Values are based on a statistical analysis of a one-time sample of devices. Minimum and maximum values are not specified and are not production tested.

6.7 Typical Characteristics

at TA = 25°C and V+ = 5 V (unless otherwise noted)
TMP275-Q1 tc_iq-tmp_sbos760.gif
Serial bus inactive
Figure 1. Quiescent Current vs Temperature
TMP275-Q1 tc_tconv-tmp_sbos760.gif
12-bit resolution
Figure 3. Conversion Time vs Temperature
TMP275-Q1 tc_iq_bus_active-tmp_sbos760.gif Figure 5. Quiescent Current with Bus Activity
vs Temperature
TMP275-Q1 tc_isd-tmp_sbos760.gif
Figure 2. Shutdown Current vs Temperature
TMP275-Q1 tc_tmp_err-tmp_sbos760.gif
Figure 4. Temperature Error vs Temperature
TMP275-Q1 tc_tmp_err_sbos760.gif Figure 6. Temperature Error at 25°C