SBOS363F June   2006  – May 2018 TMP275

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Internal Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
      3. 7.3.3 Bus Overview
      4. 7.3.4 Serial Bus Address
        1. 7.3.4.1 Writing and Reading to the TMP275
        2. 7.3.4.2 Slave Mode Operations
          1. 7.3.4.2.1 Slave Receiver Mode
          2. 7.3.4.2.2 Slave Transmitter Mode
        3. 7.3.4.3 SMBus Alert Function
        4. 7.3.4.4 General Call
        5. 7.3.4.5 High-Speed Mode
        6. 7.3.4.6 Time-Out Function
      5. 7.3.5 Timing Diagrams
      6. 7.3.6 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 Thermostat Mode (TM)
        1. 7.4.2.1 Comparator Mode (TM = 0)
        2. 7.4.2.2 Interrupt Mode (TM = 1)
      3. 7.4.3 One-Shot (OS)
    5. 7.5 Programming
      1. 7.5.1  Pointer Register
        1. 7.5.1.1 Pointer Register Byte (offset = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP275
          1. Table 3. Pointer Addresses of the TMP275 Field Description
      2. 7.5.2  Temperature Register
      3. 7.5.3  Configuration Register
      4. 7.5.4  Shutdown Mode (SD)
      5. 7.5.5  Thermostat Mode (TM)
      6. 7.5.6  Polarity (POL)
      7. 7.5.7  Fault Queue (F1/F0)
      8. 7.5.8  Converter Resolution (R1/R0)
      9. 7.5.9  One-Shot (OS)
      10. 7.5.10 High and Low Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Connections of the TMP275
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Connecting Multiple Devices on a Single Bus
      3. 8.2.3 Temperature Data Logger for Cold Chain Management Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power supply, V+ 7 V
Input voltage(2) –0.5 7 V
Input current 10 mA
Operating temperature –55 127 °C
Junction temperature, TJ max, 150 °C
Storage temperature, Tstg –60 130 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.