SBOS335F June   2005  – January 2023 TMP300

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.4 Using a DAC to Set the Trip Point

The trip point is easily converted by changing the digital-to-analog converter (DAC) code. This technique can be useful for control loops where a large thermal mass is being brought up to the set temperature and the OUT pin is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the set temperature to prevent overshoot. Figure 7-3 shows the trip set voltage error versus temperature, which shows error in °C of the comparator input over temperature. Figure 7-4 shows an alternative method of setting the trip point by using a DAC.

GUID-65AE663F-AFFB-48ED-9A25-46A1AF950F1A-low.gifFigure 7-3 Trip Set Voltage Error vs Temperature
GUID-85BD3F35-ABFD-444C-8D20-E8DE0AF18468-low.gifFigure 7-4 DAC Generates the Voltage-Driving TSET Pin