SBOS335F June   2005  – January 2023 TMP300

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.2 Using VTEMP to Trip the Digital Output

The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in Figure 7-1.

GUID-4A0061D0-1511-4035-ABFD-18CFC599ACC7-low.gifFigure 7-1 Applying Voltage to Trip Digital Output