SBOS335F June   2005  – January 2023 TMP300

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Typical Characteristics

At VS = 5 V, unless otherwise noted.

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Figure 6-1 Quiescent Current Over Temperature and Supply
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Figure 6-3 RSET vs Temperature
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Figure 6-5 Typical Analog Output Error
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Figure 6-7 Trip PSR Over Temperature
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Figure 6-2 RSET Shift Resulting From RSET Tolerance
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Figure 6-4 Typical Trip Error
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Figure 6-6 Analog PSR Over Temperature