SLOS889C October   2014  – September 2018 TMP302-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Trip Threshold Accuracy
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Configuring the TMP302-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

Designing with the TMP302-Q1 family of devices is simple. The TMP302-Q1 family of devices is a temperature switch commonly used to signal a microprocessor in the event of an over temperature condition. The temperature at which the TMP302-Q1 family of devices issues an active low alert is determined by the configuration of the TRIPSET0 and TRIPSET1 pins. These two pins are digital inputs and must be tied either high or low, according to Table 1. The TMP302-Q1 family of devices issues an active low alert when the temperature threshold is exceeded. The device has built-in hysteresis to avoid the device from signaling the microprocessor as soon as the temperature drops below the temperature threshold. The amount of hysteresis is determined by the HYSTSET pin. This pin is a digital input and must be tied either high or low, according to Table 2.

See Figure 10 and Figure 11 for typical circuit configurations.