SBOS488E June   2009  – December 2018 TMP302

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Trip Threshold Accuracy
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 HYSTSET
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Configuring the TMP302
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (October 2018) to E Revision

  • Changed the input pin supply voltage maximum value from: : VS + 0.5 and ≤ 4 V to: : VS + 0.3 and ≤ 4 VGo

Changes from C Revision (August 2015) to D Revision

  • Changed the supply voltage maximum value from: 3.6 V to: 4 VGo
  • Changed the input pin supply voltage maximum value from: VS + 0.5 V to: VS + 0.5 and ≤ 4 VGo
  • Changed the output pin voltage maximum value from: 3.6 V to: 4 VGo
  • Updated junction-to-ambient thermal resistance from 200 to 210.3Go
  • Updated junction-to-case (top) thermal resistance from 73.7 to 105.0 Go
  • Updated junction-to-board thermal resistance from 34.4 to 87.5 Go
  • Updated junction-to-top characterization parameter from 3.1 to 6.1 Go
  • Updated junction-to-board characterization parameter from 34.2 to 87.0Go
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from B Revision (December 2014) to C Revision

  • Changed device names by simplifying from TMP302A, TMP302B, TMP302C, and TMP302D to TMP302Go
  • Added plus-minus symbol to Machine Model value in ESD Ratings tableGo
  • Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended Operating Conditions tableGo
  • Added Community Resources sectionGo

Changes from A Revision (September 2009) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go