SBOS488E June   2009  – December 2018 TMP302

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Trip Threshold Accuracy
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 HYSTSET
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Configuring the TMP302
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Typical Application

Figure 10 shows the typical circuit configuration for the TMP302 family of devices. The TMP302 family of devices is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins directly to ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a 10-kΩ pullup resistor between the OUT and VS pins. Place a 0.1-µF bypass capacitor between the VS pin and ground, close to the TMP302 device.

TMP302 TMP302_TYP_APP_SCH_SBOS488.gifFigure 10. TMP302 Typical Application Schematic

Figure 11 shows the most generic implementation of the TMP302 family of devices. Switches are shown connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VS or ground. The use of switches is not strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice, connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VS pin is sufficient and minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and HYSTSET pins can be made through 0-Ω resistors which can be either populated or not populated depending upon the desired connection.

TMP302 TMP302_TYP_APPLICATION_GENERIC_SBOS488.gifFigure 11. TMP302 Generic Application Schematic