4 Revision History
Changes from H Revision (October 2018) to I Revision
- Changed input pin voltage maximum value in the Absolute Maximum Ratings table from: ((V+) + 0.5) and ≤ 4 to: ((VS) + 0.3) and ≤ 4 Go
- Changed output pin voltage maximum value n the Absolute Maximum Ratings table from: ((V+) + 0.5) and ≤ 4 to: ((VS) + 0.3) and ≤ 4 Go
Changes from G Revision (July 2017) to H Revision
- Changed supply voltage maximum value in the Absolute Maximum Ratings table from: 3.6 V to: 4 V Go
- Changed input pin voltage maximum value in the Absolute Maximum Ratings table from: VS +0.5 V to: ((V+) + 0.5) and ≤ 4Go
- Changed output pin voltage maximum value n the Absolute Maximum Ratings table from: VS +0.5 V to: ((V+) + 0.5) and ≤ 4Go
- Updated junction-to-ambient thermal resistance from 168 °C/W to 210.3 °C/W Go
- Updated junction-to-case (top) thermal resistance from 2.4 °C/W to 105.0 °C/W Go
- Updated junction-to-board thermal resistance from 42.3 °C/W to 87.5 °C/W Go
- Updated junction-to-top characterization parameter from 0.9 °C/W to 6.1 °C/W Go
- Updated junction-to-board characterization parameter from 42.3 °C/W to 87.0 °C/W Go
Changes from F Revision (February 2016) to G Revision
- Added TMP303E, TMP303F, TMP303G devices to data sheetGo
- Changed number of Device Options from 4 to 7 Go
- Changed Trip Point Accuracy in Electrical Characteristics from TA = -20 to 125°C to TA = 60 to 125°CGo
Changes from E Revision (October 2015) to F Revision
- Added cross reference to Device Option Table. Go
- Added new image for Trip Threshold Accuracy Go
- Added Trip Points covering range -20 to 125°C Go
- Added Trip Accuracy Error vs Temperature graph. Go
Changes from D Revision (September 2015) to E Revision
- Changed I/O value of HYSTSET1 row in Pin Functions tableGo
Changes from C Revision (September 2015) to D Revision
- Consolidated part number to a generic TMP303.Go
Changes from B Revision (January 2011) to C Revision
- Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
Changes from A Revision (September 2009) to B Revision
- Added TMP303B device to data sheetGo