SBOS821 November   2016 TMP421-Q1 , TMP422-Q1 , TMP423-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Remote Sensing
      3. 8.3.3 Series Resistance Cancellation
      4. 8.3.4 Differential Input Capacitance
      5. 8.3.5 Filtering
      6. 8.3.6 Sensor Fault
      7. 8.3.7 Undervoltage Lockout
      8. 8.3.8 Timeout Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
    5. 8.5 Programming
      1. 8.5.1  Serial Interface
      2. 8.5.2  Bus Overview
      3. 8.5.3  Bus Definitions
      4. 8.5.4  Serial Bus Address
      5. 8.5.5  Two-Wire Interface Slave Device Addresses
      6. 8.5.6  Read and Write Operations
      7. 8.5.7  High-Speed Mode
      8. 8.5.8  One-Shot Conversion
      9. 8.5.9  η-Factor Correction Register
      10. 8.5.10 Software Reset
      11. 8.5.11 General Call Reset
      12. 8.5.12 Identification Registers
    6. 8.6 Register Maps
      1. 8.6.1 Pointer Register
      2. 8.6.2 Temperature Registers
      3. 8.6.3 Status Register
      4. 8.6.4 Configuration Register 1
      5. 8.6.5 Configuration Register 2
      6. 8.6.6 Conversion Rate Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TMP421-Q1 Basic Connections
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 TMP422-Q1 Basic Connections
      3. 9.2.3 TMP423-Q1 Basic Connections
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Measurement Accuracy and Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

DATE REVISION NOTES
November 2016 * Initial release.