SBOS686A June   2013  – December 2014 TMP451

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary-to-Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal-to-Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Time-out Function
        6. 7.5.1.6 High-speed Mode
        7. 7.5.1.7 General Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Temperature Registers
        3. 7.6.1.3  Local Temperature High Byte Register (offset: Read = 00h; Write = N/A) [reset = 00h]
        4. 7.6.1.4  Remote Temperature High Byte Register (offset: Read = 01h; Write = N/A) [reset = 00h]
        5. 7.6.1.5  Status Register (offset: Read = 02h; Write = N/A) [reset = N/A]
        6. 7.6.1.6  Configuration Register (offset: Read = 03h; Write = 09h) [reset = 00h]
        7. 7.6.1.7  Conversion Rate Register (offset: Read = 04h; Write = 0Ah) [reset = 08h]
        8. 7.6.1.8  Local Temperature High Limit Register (offset: Read = 05h; Write = 0Bh) [reset = 55h]
        9. 7.6.1.9  Local Temperature Low Limit Register (offset: Read = 06h; Write = 0Ch) [reset = 00h]
        10. 7.6.1.10 Remote Temperature High Limit High Byte Register (offset: Read = 07h; Write = 0Dh) [reset = 55h]
        11. 7.6.1.11 Remote Temperature Low Limit High Byte Register (offset: Read = 08h; Write = 0Eh) [reset = 00h]
        12. 7.6.1.12 One-shot Start Register (offset: Read = N/A; Write = 0Fh) [reset = N/A]
        13. 7.6.1.13 Remote Temperature Low Byte Register (offset: Read = 10h; Write = N/A) [reset = 00h]
        14. 7.6.1.14 Remote Temperature Offset High Byte Register (offset: Read = 11h; Write = 11h) [reset = 00h]
        15. 7.6.1.15 Remote Temperature Offset Low Byte Register (offset: Read = 12h; Write = 12h) [reset = 00h]
        16. 7.6.1.16 Remote Temperature High Limit Low Byte Register (offset: Read = 13h; Write = 13h) [reset = 00h]
        17. 7.6.1.17 Remote Temperature Low Limit Low Byte Register (offset: Read = 14h; Write = 14h) [reset = 00h]
        18. 7.6.1.18 Local Temperature Low Byte Register (offset: Read = 15h; Write = N/A) [reset = 00h]
        19. 7.6.1.19 Remote Temperature THERM Limit Register (offset: Read = 19h; Write = 19h) [reset = 6C]
        20. 7.6.1.20 Local Temperature THERM Limit Register (offset: Read = 20h; Write = 20h) [reset = 55]
        21. 7.6.1.21 THERM Hysteresis Register (offset: Read = 21h; Write = 21h) [reset = 0Ah]
        22. 7.6.1.22 Consecutive ALERT Register (offset: Read = 22h; Write = 22h) [reset = 01h]
        23. 7.6.1.23 η-Factor Correction Register (offset: Read = 23h; Write = 23h) [reset = 00h]
        24. 7.6.1.24 Digital Filter Control Register (offset: Read = 24h; Write = 24h) [reset = 00h]
        25. 7.6.1.25 Manufacturer ID Register (offset: Read = FEh; Write = N/A) [reset = 55]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, unless otherwise noted.(1)
MIN MAX UNIT
Power supply V+ –0.3 3.6 V
Input voltage THERM, ALERT/THERM2, SDA and SCL only –0.3 3.6 V
D+ only –0.3 (V+) + 0.3 V
D– only –0.3 0.3 V
Input current 10 mA
Operating temperature –55 127 °C
Junction temperature (TJmax) 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 1.7 3.3 3.6 V
TA Operating free-air temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP451 UNIT
DQF
8 PINS
RθJA Junction-to-ambient thermal resistance 171.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.4
RθJB Junction-to-board thermal resistance 137.9
ψJT Junction-to-top characterization parameter 3.9
ψJB Junction-to-board characterization parameter 140
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA = –40°C to 125°C and V+ = 3.3 V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNIT
TEMPERATURE ERROR
TELOCAL Local temperature sensor TA = 0°C to 70°C ±0.25 ±1 °C
TA = –40°C to 125°C ±1 ±2 °C
TEREMOTE Remote temperature sensor(1) TA = 0°C to 70°C, TD = –55°C to 150°C ±0.25 ±1 °C
TA = –40°C to 100°C, TD = –55°C to 150°C ±1 ±2 °C
TA = –40°C to 125°C, TD = –55°C to 150°C ±2 ±4 °C
Remote temperature sensor versus supply (local or remote) V+ = 1.7 V to 3.6 V ±0.1 ±0.25 °C/V
TEMPERATURE MEASUREMENT
Conversion time One-Shot mode, local and remote total 31 34 ms
Local temperature sensor resolution 12 Bits
Remote temperature sensor resolution 12 Bits
Remote sensor source current, high Series resistance 1 kΩ max 120 μA
Remote sensor source current, medium 45 μA
Remote sensor source current, low 7.5 μA
η Remote transistor ideality factor TMP451 optimized ideality factor 1.008
SMBus INTERFACE
VIH High-level input voltage 1.4 V
VIL Low-level input voltage 0.45 V
Hysteresis 200 mV
SMBus output low sink current 6 mA
VOL Low-level output voltage IO = 6 mA 0.15 0.4 V
Logic input current 0 V ≤ VI ≤ 3.6 V –1 1 μA
SMBus input capacitance 3 pF
SMBus clock frequency 0.01 2.5 MHz
SMBus time-out 20 25 30 ms
SCL falling edge to SDA valid time 1 μs
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
VOL Low-level output voltage IO = 6 mA 0.15 0.4 V
IOH High-level output leakage current VO = V+ 1 μA
POWER SUPPLY
V(V+) Specified voltage range 1.7 3.6 V
IQ Quiescent current 0.0625 conversions per second 27 40 μA
16 conversions per second 165 250 μA
32 conversions per second 300 450 μA
Serial bus inactive, shutdown mode 3 8 μA
Serial bus active, ƒS = 400 kHz, shutdown mode 90 μA
Serial bus active, ƒS = 2.5 MHz, shutdown mode 350 μA
POR Power-on reset threshold 1.2 1.55 V
(1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance.

6.6 Timing Requirements

PARAMETER FAST MODE HIGH-SPEED MODE UNIT
MIN TYP MAX MIN TYP MAX
ƒ(SCL) SCL operating frequency 0.001 0.4 0.001 2.5 MHz
t(BUF) Bus free time between STOP and START Condition 1300 260 ns
t(HDSTA) Hold time after repeated START condition. After this period, the first clock is generated. 600 160 ns
t(SUSTA) Repeated START condition setup time 600 160 ns
t(SUSTO) STOP condition setup time 600 160 ns
t(HDDAT) Data hold time 0 900 0 150 ns
t(SUDAT) Data setup time 100 30 ns
t(LOW) SCL clock LOW period 1300 260 ns
t(HIGH) SCL clock HIGH period 600 60 ns
tF, tR – SDA Data fall and rise time 300 80 ns
tF, tR – SCL Clock fall and rise time 300 40 ns
tR Rise time for SCL ≤ 100 kHz   1000 ns
ai_tim_2wire.gifFigure 1. Two-Wire Timing Diagram

6.7 Typical Characteristics

At TA = 25°C and V+ = 3.3 V, unless otherwise noted.
C001_slos877.gif
Figure 2. Local Temperature Error vs Temperature
C003_SBOS686.png
Figure 4. Remote Temperature Error vs Leakage Resistance
C005_SBOS686.png
Figure 6. Remote Temperature Error vs differential Capacitance
C007_SBOS686.png
Figure 8. Quiescent Current vs Conversion Rate
C009_SBOS686.png
Figure 10. Quiescent Current vs Supply Voltage
(At Default Conversion Rate of 16 Conversions per Second)
C002_slos877.gif
Figure 3. Remote Temperature Error vs Temperature
C004_SBOS686.png
Figure 5. Remote Temperature Error vs Series Resistance
C006_slos877.gif
Figure 7. Remote Temperature Error vs Remote Channel Noise Frequency
C008_SBOS686.png
Figure 9. Shutdown Quiescent Current
vs SCL Clock Frequency
C010_SBOS686.png
Figure 11. Shutdown Quiescent Current
vs Supply Voltage