SBOS876B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Block Diagram
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Registers
        3. 7.6.1.3  Status Register
        4. 7.6.1.4  Configuration Register
        5. 7.6.1.5  Conversion Rate Register
        6. 7.6.1.6  One-Shot Start Register
        7. 7.6.1.7  Channel Enable Register
        8. 7.6.1.8  Consecutive ALERT Register
        9. 7.6.1.9  η-Factor Correction Register
        10. 7.6.1.10 Remote Temperature Offset Register
        11. 7.6.1.11 Manufacturer Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TMP461-SP device is a radiation-hardened, high-accuracy, low-power remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensors are typically low-cost discrete NPN or PNP transistors, or substrate thermal transistors or diodes that are integral parts of microprocessors, analog-to-digital converters (ADC), digital-to-analog converters (DAC), microcontrollers, or field-programmable gate arrays (FPGA). Temperature is represented as a 12-bit digital code for both local and remote sensors, giving a resolution of 0.0625°C. The two-wire serial interface accepts the SMBus communication protocol with up to nine different pin-programmable addresses.

Advanced features such as series resistance cancellation, programmable nonideality factor (η-factor), programmable offset, programmable temperature limits, and a programmable digital filter, are combined to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

The TMP461-SP is ideal for multi-location, high-accuracy temperature measurements in a variety of distributed telemetry applications. The integrated local and remote temperature sensors simplify spacecraft housekeeping activities by providing an easy way of measuring temperature gradients. The device is specified for operation over a supply voltage range of 1.7 V to 3.6 V, and a temperature range of –55°C to 125°C.

Device Information(1)

PART NUMBER GRADE PACKAGE
5962-1721801VXC QMLV
10-lead CFP [HKU]
7.02 mm × 6.86 mm
TMP461HKU/EM Engineering Samples(2) 10-lead CFP [HKU]
7.02 mm × 6.86 mm
TMP461EVM-CVAL Ceramic Evaluation Board
5962R1721801VXC RHA - 100 krad(Si) 10-lead CFP [HKU]
7.02 mm × 6.86 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.
  2. These units are intended for engineering evaluation only. They are processed to a noncompliant flow. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warrantied for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.