SBOS876B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Block Diagram
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Registers
        3. 7.6.1.3  Status Register
        4. 7.6.1.4  Configuration Register
        5. 7.6.1.5  Conversion Rate Register
        6. 7.6.1.6  One-Shot Start Register
        7. 7.6.1.7  Channel Enable Register
        8. 7.6.1.8  Consecutive ALERT Register
        9. 7.6.1.9  η-Factor Correction Register
        10. 7.6.1.10 Remote Temperature Offset Register
        11. 7.6.1.11 Manufacturer Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

The specifications shown below correspond to the respectively identified subgroup temperature (see Table 1). V+ = 1.7 V to 3.6 V, unless otherwise noted.
PARAMETER CONDITIONS SUBGROUP(1) MIN TYP MAX UNIT
TEMPERATURE MEASUREMENT
TALOCAL Local temperature sensor accuracy V+ = 1.7 V to 3.6 V [1, 2, 3] –2 ±0.5 2 °C
TAREMOTE Remote temperature sensor accuracy V+ = 1.7 V to 3.6 V [1, 2, 3] –1.5 ±0.125 1.5 °C
Temperature sensor error versus supply (local or remote) V+ = 1.7 V to 3.6 V [1, 2, 3] –0.3 ±0.1 0.3 °C/V
Temperature resolution
(local and remote)		 0.0625 °C
ADC conversion time One-shot mode, per channel (local or remote) [9, 10, 11] 15 17 ms
ADC resolution [4, 5, 6] 12 Bits
Remote sensor source current High Series resistance 1 kΩ (max) [1, 2, 3] 88 120 152 µA
Medium [1, 2, 3] 33 45 57
Low [1, 2, 3] 5.5 7.5 9.5
η Remote transistor ideality factor TMP461-SP optimized ideality factor 1.008
SERIAL INTERFACE
VIH High-level input voltage [1, 2, 3] 1.4 V
VIL Low-level input voltage [1, 2, 3] 0.45 V
Hysteresis 200 mV
SDA output-low sink current [1, 2, 3] 6 mA
VOL Low-level output voltage IO = –6 mA [1, 2, 3] 0.15 0.4 V
Serial bus input leakage current 0 V ≤ VIN ≤ 3.6 V [1, 2, 3] –1 1 μA
Serial bus input capacitance SCL 3 pF
SDA 4.6 pF
Serial bus clock frequency [9, 10, 11] 2.17 MHz
Serial bus timeout [9, 10, 11] 20 25 30 ms
DIGITAL INPUTS (A0, A1)
VIH High-level input voltage [1, 2, 3] 0.9(V+) (V+) + 0.3 V
VIL Low-level input voltage [1, 2, 3] –0.3 0.1(V+) V
Input leakage current 0 V ≤ VIN ≤ 3.6 V [1, 2, 3] –1 1 μA
Input capacitance 2.5 pF
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
Output-low sink current [1, 2, 3] 6 mA
VOL Low-level output voltage IO = –6 mA [1, 2, 3] 0.15 0.4 V
IOH High-level output leakage current VO = V+ [1, 2, 3] 1 μA
POWER SUPPLY
V+ Specified supply voltage range [1, 2, 3] 1.7 3.6 V
IQ Quiescent current Active conversion, local sensor [1, 2, 3] 240 375 µA
Active conversion, remote sensor [1, 2, 3] 400 600
Standby mode (between conversions) [1, 2, 3] 15 35
Shutdown mode, serial bus inactive [1, 2, 3] 3 8
Shutdown mode, serial bus active, fS = 400 kHz 90
Shutdown mode, serial bus active, fS = 2.17 MHz 350
POR Power-on reset threshold Rising edge [1, 2, 3] 1.2 1.55 V
(1) For subgroup definitions, please see Table 1.