SBOS722B June   2015  – August 2016 TMP461

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Block Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Two-Wire Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
        1. 8.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 8.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Differential Input Capacitance
      4. 8.3.4 Filtering
      5. 8.3.5 Sensor Fault
      6. 8.3.6 ALERT and THERM Functions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Bus Overview
        2. 8.5.1.2 Bus Definitions
        3. 8.5.1.3 Serial Bus Address
        4. 8.5.1.4 Read and Write Operations
        5. 8.5.1.5 Timeout Function
        6. 8.5.1.6 High-Speed Mode
      2. 8.5.2 General-Call Reset
    6. 8.6 Register Map
      1. 8.6.1 Register Information
        1. 8.6.1.1  Pointer Register
        2. 8.6.1.2  Local and Remote Temperature Registers
        3. 8.6.1.3  Status Register
        4. 8.6.1.4  Configuration Register
        5. 8.6.1.5  Conversion Rate Register
        6. 8.6.1.6  One-Shot Start Register
        7. 8.6.1.7  Channel Enable Register
        8. 8.6.1.8  Consecutive ALERT Register
        9. 8.6.1.9  η-Factor Correction Register
        10. 8.6.1.10 Remote Temperature Offset Register
        11. 8.6.1.11 Manufacturer Identification Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.