SBOS722B June   2015  – August 2016 TMP461

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Block Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Two-Wire Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
        1. 8.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 8.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Differential Input Capacitance
      4. 8.3.4 Filtering
      5. 8.3.5 Sensor Fault
      6. 8.3.6 ALERT and THERM Functions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Bus Overview
        2. 8.5.1.2 Bus Definitions
        3. 8.5.1.3 Serial Bus Address
        4. 8.5.1.4 Read and Write Operations
        5. 8.5.1.5 Timeout Function
        6. 8.5.1.6 High-Speed Mode
      2. 8.5.2 General-Call Reset
    6. 8.6 Register Map
      1. 8.6.1 Register Information
        1. 8.6.1.1  Pointer Register
        2. 8.6.1.2  Local and Remote Temperature Registers
        3. 8.6.1.3  Status Register
        4. 8.6.1.4  Configuration Register
        5. 8.6.1.5  Conversion Rate Register
        6. 8.6.1.6  One-Shot Start Register
        7. 8.6.1.7  Channel Enable Register
        8. 8.6.1.8  Consecutive ALERT Register
        9. 8.6.1.9  η-Factor Correction Register
        10. 8.6.1.10 Remote Temperature Offset Register
        11. 8.6.1.11 Manufacturer Identification Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply V+ –0.3 6 V
Input voltage THERM, ALERT/THERM2, SDA and SCL only –0.3 6 V
D+, A0, A1 –0.3 (V+) + 0.3
D– only –0.3 0.3
Input current 10 mA
Operating temperature –55 150 °C
Junction temperature (TJ max) 150 °C
Storage temperature, Tstg –60 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V+ Supply voltage 1.7 3.3 3.6 V
TA Operating free-air temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) TMP461 UNIT
RUN (WQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 123.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.1 °C/W
RθJB Junction-to-board thermal resistance 78.1 °C/W
ψJT Junction-to-top characterization parameter 4.6 °C/W
ψJB Junction-to-board characterization parameter 78.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

At TA = –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNIT
TEMPERATURE MEASUREMENT
TALOCAL Local temperature sensor accuracy TA = –10°C to 100°C, V+ = 1.7 V to 3.6 V -1 ±0.125 +1 °C
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V -1.25 ±0.5 +1.25
TAREMOTE Remote temperature sensor accuracy TA = 0°C to 100°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V		 -0.75 ±0.125 + 0.75 °C
TA = –40°C to 125°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V		 -1.5 ±0.5 +1.5
Temperature sensor error versus supply (local or remote) V+ = 1.7 V to 3.6 V -0.25 ±0.1 +0.25 °C/V
Temperature resolution
(local and remote)		 0.0625 °C
ADC conversion time One-shot mode, per channel (local or remote) 15 17 ms
ADC resolution 12 Bits
Remote sensor source current High Series resistance 1 kΩ (max) 88 120 152 µA
Medium 33 45 57
Low 5.5 7.5 9.5
η Remote transistor ideality factor TMP461 optimized ideality factor 1.008
SERIAL INTERFACE
VIH High-level input voltage 1.4 V
VIL Low-level input voltage 0.45 V
Hysteresis 200 mV
SDA output-low sink current 6 mA
VOL Low-level output voltage IO = –6 mA 0.15 0.4 V
Serial bus input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Serial bus input capacitance SCL 3 6 pF
SDA 4.6 9 pF
Serial bus clock frequency 0.001 2.17 MHz
Serial bus timeout 20 25 30 ms
DIGITAL INPUTS (A0, A1)
VIH High-level input voltage 0.9(V+) (V+) + 0.3 V
VIL Low-level input voltage –0.3 0.1(V+) V
Input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Input capacitance 2.5 5 pF
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
Output-low sink current 6 mA
VOL Low-level output voltage IO = –6 mA 0.15 0.4 V
IOH High-level output leakage current VO = V+ 1 μA
POWER SUPPLY
V+ Specified supply voltage range 1.7 3.6 V
IQ Quiescent current Active conversion, local sensor 240 375 µA
Active conversion, remote sensor 400 600
Standby mode (between conversions) 15 35
Shutdown mode, serial bus inactive 3 8
Shutdown mode, serial bus active, fS = 400 kHz 90
Shutdown mode, serial bus active, fS = 2.17 MHz 350
POR Power-on reset threshold Rising edge 1.2 1.55 V

7.6 Two-Wire Timing Requirements

At –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 0.001 0.4 0.001 2.17 MHz
t(BUF) Bus free time between stop and start condition 1300 160 ns
t(HDSTA) Hold time after repeated start condition.
After this period, the first clock is generated.		 600 160 ns
t(SUSTA) Repeated start condition setup time 600 160 ns
t(SUSTO) Stop condition setup time 600 160 ns
t(HDDAT) Data hold time 0 900 0 150 ns
t(SUDAT) Data setup time 100 40 ns
t(LOW) SCL clock low period 1300 320 ns
t(HIGH) SCL clock high period 600 60 ns
tF – SDA Data fall time 300 130 ns
tF, tR – SCL Clock fall and rise time 300 40 ns
tR Rise time for SCL ≤ 100 kHz   1000 ns
TMP461 ai_tim_2wire.gif Figure 1. Two-Wire Timing Diagram

7.7 Typical Characteristics

At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
TMP461 D017_SBOS722.gif
Typical behavior of 25 devices over temperature
Figure 2. Local Temperature Error vs
Ambient Temperature
TMP461 D003_SBOS722.gif
Figure 4. Remote Temperature Error vs
Leakage Resistance
TMP461 D005_SBOS722.gif
No physical series resistance on D+, D– pins during measurement
Figure 6. Remote Temperature Error vs
Differential Capacitance
TMP461 D008_SBOS722.gif
16 samples per second (default mode)
Figure 8. Shutdown Quiescent Current
vs SCL Clock Frequency
TMP461 D010_SBOS722.gif
Figure 10. Shutdown Quiescent Current
vs Supply Voltage
TMP461 D016_SBOS722.gif
Typical behavior of 25 devices over temperature
Figure 3. Remote Temperature Error vs
Ambient Temperature
TMP461 D004_SBOS722.gif
No physical capacitance during measurement
Figure 5. Remote Temperature Error vs
Series Resistance
TMP461 D007_SBOS722.gif
Figure 7. Quiescent Current vs Conversion Rate
TMP461 D009_SBOS722.gif
Figure 9. Quiescent Current vs Supply Voltage
(At Default Conversion Rate of 16 Conversions per Second)