SNIS211D October   2019  – November 2020 TMP63

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TMP63 R-T table
      2. 8.3.2 Linear Resistance Curve
      3. 8.3.3 Positive Temperature Coefficient (PTC)
      4. 8.3.4 Built-In Fail Safe
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Thermistor Biasing Circuits
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Thermal Protection With Comparator
          2. 9.2.1.2.2 Thermal Foldback
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

Get started today with the Thermistor Design Tool, offering complete resistance vs temperature table (R-T table) computation, other helpful methods to derive temperature and example C-code.

Linear thermistors offer linearity and consistent sensitivity across temperature to enable simple and accurate methods for temperature conversion. Low power consumption and a small thermal mass minimize the impact of self-heating. With built-in failsafe behavior at high temperatures and powerful immunity to environmental variation, these devices are designed for a long lifetime of high performance. The small size of the TMP6 series also allows for close placement to heat sources and quick response times.

Take advantage of benefits over NTC thermistors such as no extra linearization circuitry, minimized calibration, less resistance tolerance variation, larger sensitivity at high temperatures, and simplified conversion methods to save time and memory in the processor.

The TMP63 is currently available in a 0402 footprint-compatible X1SON package and a 0603 footprint-compatible SOT-5X3 package.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TMP63 X1SON (2) 0.60 mm × 1.00 mm
SOT-5X3 (2) 0.80 mm × 1.20 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-C8F4056D-544E-4DA5-812F-E6DC9F84ABC0-low.gifTypical Implementation
GUID-20200911-CA0I-NFQS-Q93H-96SD8NFNZ8Z8-low.gifTypical Resistances vs Ambient Temperature