SNIS211D October   2019  – November 2020 TMP63

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TMP63 R-T table
      2. 8.3.2 Linear Resistance Curve
      3. 8.3.3 Positive Temperature Coefficient (PTC)
      4. 8.3.4 Built-In Fail Safe
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Thermistor Biasing Circuits
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Thermal Protection With Comparator
          2. 9.2.1.2.2 Thermal Foldback
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25 °C, (unless otherwise noted)

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Figure 7-1 Resistance vs. Ambient Temperature Using Multiple Bias Currents
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Figure 7-3 TCR vs. Sense Currents (ISNS)
GUID-20200911-CA0I-SQ02-FN7Q-WWVBBX2VGQZH-low.gif

 

Figure 7-5 Supply Dependence Resistance vs. Bias Current
GUID-D27684AA-1578-4097-AD36-E0F1ED06A633-low.gif
VSNS = 1 V.
Figure 7-7 Step Response
GUID-DD26FCE5-D46D-4788-8193-5C76519F7A77-low.gif
Ambient material: stirred liquid. Temperature: 25 °C to 125 °C
Figure 7-9 DYA Thermal Response Time
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RBIAS = 100 kΩ with ±0.01 % tolerance
Figure 7-2 Resistance vs. Ambient Temperature Using Multiple Bias Voltages
GUID-A8C55E70-54E9-40CB-9BFA-BBE9F8B38952-low.gif
RBias = 100 kΩ with ±0.01 % Tolerance
Figure 7-4 TCR as a Function of Sense Voltages, VSns
GUID-20200911-CA0I-QMTV-MT6P-RCWT7JS2JFSN-low.gif
RBias = 100 kΩ ( ±0.01 % tolerance)
Figure 7-6 Supply Dependence vs. Bias Voltage
GUID-DD26FCE5-D46D-4788-8193-5C76519F7A77-low.gif
Ambient material: stirred liquid. Temperature: 25 °C to 125 °C
Figure 7-8 DEC Thermal Response Time
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Ambient material: still air
Figure 7-10 Thermal Response Time