SNIS211D October 2019 – November 2020 TMP63
PRODUCTION DATA
THERMAL METRIC(1) (2) | TMP63 | UNIT | ||
---|---|---|---|---|
DEC (X1SON) | DYA (SOT-5X3) | |||
2 PINS | 2 PINS | |||
RθJA | Junction-to-ambient thermal resistance(3) (4) | 443.4 | 742.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 195.7 | 315.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 254.6 | 506.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 19.9 | 109.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 254.5 | 500.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | °C/W |