SNIS212C December   2019  – September 2020 TMP64

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TMP64 R-T table
      2. 8.3.2 Linear resistance curve
      3. 8.3.3 Positive Temperature Coefficient (PTC)
      4. 8.3.4 Built-In Fail Safe
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Thermistor Biasing Circuits
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Thermal Protection With Comparator
          2. 9.2.1.2.2 Thermal Foldback
      2. 9.2.2 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision B (June 2020) to Revision C (September 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed DYA package previewGo
  • Updated DYA maximum temperature rating to 150 °C in device comparison tableGo
  • Removed preview notice on DYA packageGo
  • Changed Junction temperature from 150 °C to 155 °C in Absolute Maximum Ratings TableGo
  • Changed Storage temperature from 150 °C to 155 °C in Absolute Maximum Ratings TableGo
  • Added DYA Ambient Temperature Rating to Recommended Operating Conditions TableGo
  • Added DYA Long Term Drift specificationsGo
  • Changed Typical Characteristics sectionGo
  • Added Application Curve sectionGo

Changes from Revision A (March 2019) to Revision B (June 2020)

  • Added DYA (SOT-5X3) preview packageGo
  • Updated Device Comparison tableGo
  • Corrected view description in pin configurations and functionsGo
  • Changed ISNS maximum from 400 µA to 100 µA in Recommended Operating Conditions TableGo

Changes from Revision Original (December 2019) to Revision A (March 2020)

  • Changed data sheet status from: Advanced Information to: Production DataGo
  • Updated TitleGo
  • Updated FeaturesGo
  • Updated ApplicationsGo
  • Updated DescriptionGo
  • Increased CDM Rating from ±750 V to ± 1000 V in ESD Ratings TableGo
  • Changed minimum 'Long Term Drift' spec for RH = 85 % from 0.1 % to -1 %Go
  • Added typical. 'Long Term Drift' spec for RH = 85 %Go
  • Changed maximum 'Long Term Drift' spec for RH = 85 % from 0.8 % to 1 %Go
  • Changed minimum 'Long Term Drift' spec from 0.1 % to -1%Go
  • Added typical. 'Long Term Drift' specGo
  • Changed maximum 'Long Term Drift' spec  from 1 % to 1.8 %Go
  • Added 'Supply Dependence Resistance vs. Bias Current' graphGo
  • Added 'Supply Dependence Resistance vs. Bias Voltage' graphGo
  • Added 'Step Response' graphGo
  • Updated Thermistor Design Tool linkGo