• Menu
  • Product
  • Email
  • PDF
  • Order now

  • TMP709 Resistor-Programmable Temperature Switch in SOT Package

    • SBOS583B December   2011  – December 2016 TMP709

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • TMP709 Resistor-Programmable Temperature Switch in SOT Package
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Switch
      2. 7.3.2 Hysteresis Input
      3. 7.3.3 Set-Point Resistor (RSET)
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • DBV|5
    • MPDS018T
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sbos583b_oa
  • sbos583b_pm
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TMP709 Resistor-Programmable Temperature Switch in SOT Package

1 Features

  • Threshold Accuracy:
    • ±0.5°C Typical
    • ±3°C Maximum (60°C to 100°C)
  • Temperature Threshold Set By 1% External Resistor
  • Low Quiescent Current: 40 μA Typical
  • Open-Drain, Active-Low Output Stage
  • Pin-Selectable 2°C or 10°C Hysteresis
  • Reset Operation Specified at VCC = 0.8 V
  • Supply Range: 2.7 V to 5.5 V
  • Package: 5-Pin SOT-23

2 Applications

  • Computers (Laptops and Desktops)
  • Servers
  • Industrial and Medical Equipment
  • Storage Area Networks
  • Automotive

3 Description

The TMP709 is a fully-integrated, resistor- programmable temperature switch with a temperature threshold that is set by just one external resistor within the entire operating range. The TMP709 provides an open-drain, active-low output and has a 2.7-V to 5.5-V supply-voltage range.

The temperature threshold accuracy is typically ±0.5°C, with a maximum of ±3°C (60°C to 100°C). The quiescent current consumption is typically 40 μA. Hysteresis is pin-selectable to 2°C or 10°C.

The TMP709 is available in a 5-pin, SOT-23 package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMP709 SOT-23 (5) 2.90 mm x 1.60 mm
  1. For all available packages, see the package option addendum at the end of the datasheet.

Typical Application

TMP709 pg1_typ_app_bos583.gif

4 Revision History

Changes from A Revision (February 2012) to B Revision

  • Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Package and Ordering Information table; information now available in package option addendum located at the end of this data sheet Go

Changes from * Revision (December 2011) to A Revision

  • Updated threshold accuracy feature bullet Go
  • Updated threshold accuracy text in second paragraph of Description sectionGo
  • Updated temperature error parameter in the Electrical CharacteristicsGo

5 Pin Configuration and Functions

DBV Package
5-Pin SOT-23
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
GND 2 Analog power Device ground
HYST 4 Digital input Hysteresis selection. For 10°C, HYST = VCC; for 2°C, HYST = GND.
OT 3 Digital output Open-drain, active low output
SET 1 Analog input Temperature set point. Connect an external 1% resistor between SET and GND.
VCC 5 Analog power Power-supply voltage (2.7 V to 5.5 V)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage Supply, VCC –0.3 6 V
Input, SET and HYST –0.3 VCC + 0.3
Output, OT –0.3 6
Current Input 20 mA
Output 20
Temperature Operating, TA –40 125 °C
Junction, TJ 150
Storatge, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (MM) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 2.7 5.5 V
TA Operating temperature 0 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP709 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 217.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86.3 °C/W
RθJB Junction-to-board thermal resistance 44.6 °C/W
ψJT Junction-to-top characterization parameter 4.4 °C/W
ψJB Junction-to-board characterization parameter 43.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at TA = 0°C to 125°C and VCC = 2.7 V to 5.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
ICC Supply current VCC = 5 V 40 55 µA
VCC = 2.7 V 40 55 µA
TEMPERATURE
TE Temperature error TA = 60°C to 100°C ±0.5 ±3 °C
DIGITAL INPUT (HYST)
VIH High-level input voltage 0.7 × VCC V
VIL Low-level input voltage 0.3 × VCC V
CIN Input capacitance 10 pF
ANALOG INPUT (SET)
VIN Input voltage range 0 VCC V
Ilkg_in Input leakage current 1 µA
DIGITAL OPEN-DRAIN OUTPUT (OT)
I(OT_SINK) Output sink current VOT = 0.3 V 5 12 mA
Ilkg(OT) Output leakage current VOT = VCC 1 µA

6.6 Typical Characteristics

at TA = 25°C and VCC = 2.7 V to 5.5 V (unless otherwise noted)
TMP709 tc_is-tmp_bos585.gif
Figure 1. Supply Current vs Temperature
TMP709 tc_hyst-tmp_bos583.gif
Figure 3. Hysteresis vs Trip Temperature
TMP709 tc_rset-tmp_bos585.gif
Figure 2. RSET vs Trip Temperature
TMP709 tc_tmp_err-tmp_bos585.gif
Figure 4. Temperature Error vs Trip Temperature

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale