SBOS759 November   2015 TMP175-Q1 , TMP75-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading to the TMP175-Q1 and TMP75-Q1
        4. 7.3.2.4 Slave Mode Operations
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed Mode
        8. 7.3.2.8 Time-out Function
      3. 7.3.3 Timing Diagrams
        1. 7.3.3.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot (OS)
      3. 7.4.3 Thermostat Mode (TM)
        1. 7.4.3.1 Comparator Mode (TM = 0)
        2. 7.4.3.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Polarity (POL)
        2. 7.5.3.2 Fault Queue (F1/F0)
        3. 7.5.3.3 Converter Resolution (R1/R0)
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 Qualified with:
    • Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
    • HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • TMP175-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±2°C (Maximum) from –40°C to +125°C
  • TMP75-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±3°C (Maximum) from –40°C to +125°C
  • TMP175-Q1: 27 Addresses
  • TMP75-Q1: 8 Addresses, NIST Traceable
  • Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
  • Resolution: 9 to 12 Bits, User-Selectable
  • Low Quiescent Current: 50-μA, 0.1-μA Standby
  • Wide Supply Range: 2.7 V to 5.5 V
  • Small 8-Pin VSSOP and 8-Pin SOIC Packages

2 Applications

  • Climate Controls
  • Infotainment Processor Management
  • Airflow Sensors
  • Battery Control Units
  • Engine Control Units
  • UREA Sensors
  • Water Pumps
  • HID Lamps
  • Airbag Control Units

    • Simplified Schematic

    TMP175-Q1 TMP75-Q1 frontpage_simp_schema_sbos759.gif

3 Description

The TMP75-Q1 and TMP175-Q1 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit, analog-to-digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry-standard, LM75, 8-pin SOIC and VSSOP footprint.

The TMP175-Q1 and TMP75-Q1 feature SMBus, two-wire, and I2C interface compatibility. The TMP175-Q1 device allows up to 27 devices on one bus. The TMP75-Q1 allows up to eight devices on one bus. The TMP175-Q1 and TMP75-Q1 both feature an SMBus alert function.

The TMP175-Q1 and TMP75-Q1 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP75-Q1 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.

The TMP175-Q1 and TMP75-Q1 devices are specified for operation over the temperature range of –40°C to +125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMPx75-Q1 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

TMP175-Q1 and TMP75-Q1 Internal Block Diagram

TMP175-Q1 TMP75-Q1 temp175_75_bos288j.gif

4 Revision History

DATE REVISION NOTES
November 2015 * Initial release.