SBOS721B October   2014  – October 2024 TMP75B-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1  Bus Overview
        2. 7.3.3.2  Serial Bus Address
        3. 7.3.3.3  Writing and Reading Operation
        4. 7.3.3.4  Target-Mode Operations
          1. 7.3.3.4.1 Target Receiver Mode:
          2. 7.3.3.4.2 Target Transmitter Mode:
        5. 7.3.3.5  SMBus Alert Function
        6. 7.3.3.6  General Call
        7. 7.3.3.7  High-Speed (Hs) Mode
        8. 7.3.3.8  Timeout Function
        9. 7.3.3.9  Two-Wire Timing
        10. 7.3.3.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
  9. Register Map
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TMP75B-Q1 is an integrated digital temperature sensor with a 12-bit analog-to-digital converter (ADC) that can operate at a 1.8V supply, and is pin and register compatible with the industry-standard LM75 and TMP75. This device is available in SOIC-8 and VSSOP-8 packages, and requires no external components to sense the temperature. The TMP75B-Q1 is capable of reading temperatures with a resolution of 0.0625°C with operating temperature range of –40°C to 125°C. The TMP75BTQDGKRQ1 is tri-temperature (–40°C, 25°C, and 125°C) tested in production for improved robustness.

The TMP75B-Q1 features SMBus and two-wire interface compatibility, and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The programmable temperature limits and the ALERT pin allow the sensor to operate as a stand-alone thermostat, or an overtemperature alarm for power throttling or system shutdown. The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP75B-Q1 the preferred solution for temperature compensation of other sensors and electronic components. The TMP75B-Q1 is designed for thermal management and protection of a variety of automotive applications, and is a high-performance alternative to a PCB-mounted thermistor.

Package Information
DEVICE NAMEPACKAGE(1)PACKAGE SIZE(2)

TMP75BQDRQ1

D (SOIC, 8)4.9mm × 6mm
TMP75BQDGKRQ1DGK (VSSOP, 8)3mm × 4.9mm

TMP75BTQDGKRQ1

For all available packages, see Section 12.
The package size (length × width) is a nominal value and includes pins, where applicable.
TMP75B-Q1 Temperature Accuracy (Error) vs Ambient TemperatureTemperature Accuracy (Error) vs Ambient Temperature