SBOS721A October 2014 – June 2022 TMP75B-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TMP75B-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGK (VSSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 125.4 | 188.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 71.5 | 79.1 | |
RθJB | Junction-to-board thermal resistance | 65.8 | 109.6 | |
ψJT | Junction-to-top characterization parameter | 21.1 | 15.3 | |
ψJB | Junction-to-board characterization parameter | 65.3 | 108 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A |