SBOS721B October   2014  – October 2024 TMP75B-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1  Bus Overview
        2. 7.3.3.2  Serial Bus Address
        3. 7.3.3.3  Writing and Reading Operation
        4. 7.3.3.4  Target-Mode Operations
          1. 7.3.3.4.1 Target Receiver Mode:
          2. 7.3.3.4.2 Target Transmitter Mode:
        5. 7.3.3.5  SMBus Alert Function
        6. 7.3.3.6  General Call
        7. 7.3.3.7  High-Speed (Hs) Mode
        8. 7.3.3.8  Timeout Function
        9. 7.3.3.9  Two-Wire Timing
        10. 7.3.3.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
  9. Register Map
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

At TA = –40°C to 125°C and VS = 1.4 V to 3.6 V, unless otherwise noted. Typical values at TA = 25°C and VS = 1.8 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
Temperature Range -40 125 °C  
Temperature resolution 0.0625 °C  
Temperature accuracy (error) TMP75BQDGKRQ1
TMP75BQDRQ1
–20°C to 85°C ±0.5 ±2 °C
–40°C to 125°C ±1 ±3 °C
TMP75BTQDGKRQ1 –40°C to 125°C ±0.5 ±2 °C
DIGITAL INPUT/OUTPUT
VIH High-level input voltage 0.7(VS) VS V
VIL Low-level input voltage –0.3 0.3(VS) V
IIN Input current  0 V< VIN < (VS) + 0.3 V 1 μA
VOL Low-level output voltage VS ≥ 2 V, IOUT = 3 mA 0 0.4 V
VOL VS < 2 V, IOUT = 3 mA 0 0.2(VS) V
ADC resolution 12 Bits
Conversion time One-shot mode 20 27 35 ms
Conversion modes CR1 = 0, CR0 = 0 (default) 37 Conv/s
CR1 = 0, CR0 = 1 18 Conv/s
CR1 = 1, CR0 = 0 9 Conv/s
CR1 = 1, CR0 = 1 4 Conv/s
Timeout time 38 54 70 ms
POWER SUPPLY
Operating supply range 1.4 3.6 V
IQ Quiescent current Serial bus inactive, CR1 = 0, CR0 = 0 (default) 45 89 μA
Serial bus inactive, CR1 = 0, CR0 = 1 22 48 μA
Serial bus inactive, CR1 = 1, CR0 = 0 12 30 μA
Serial bus inactive, CR1 = 1, CR0 = 1 6.5 21 μA
ISD Shutdown current Serial bus inactive 0.3 8 μA
Serial bus active, SCL frequency = 400 kHz 10 μA
Serial bus active, SCL frequency = 3.4 MHz 80 μA