SBOS721B October   2014  – October 2024 TMP75B-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1  Bus Overview
        2. 7.3.3.2  Serial Bus Address
        3. 7.3.3.3  Writing and Reading Operation
        4. 7.3.3.4  Target-Mode Operations
          1. 7.3.3.4.1 Target Receiver Mode:
          2. 7.3.3.4.2 Target Transmitter Mode:
        5. 7.3.3.5  SMBus Alert Function
        6. 7.3.3.6  General Call
        7. 7.3.3.7  High-Speed (Hs) Mode
        8. 7.3.3.8  Timeout Function
        9. 7.3.3.9  Two-Wire Timing
        10. 7.3.3.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
  9. Register Map
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

STANDARD FAST-MODE UNIT
Min Max Min Max
fSCL SCL operating frequency VS ≥ 1.8 V 0.001 0.4 0.001 3 MHz
VS < 1.8 V 0.001 0.4 0.001 2.5 MHz
t(BUF) Bus-free time between STOP and START conditions VS ≥ 1.8 V 1300 160 ns
VS < 1.8 V 1300 260 ns
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.
600 160 ns
t(SUSTA) Repeated START condition setup time 600 160 ns
t(SUSTO) STOP condition setup time 600 160 ns
t(HDDAT) Data hold time VS ≥ 1.8 V 0 900 0 100 ns
VS < 1.8 V 0 900 0 140 ns
t(SUDAT) Data setup time VS ≥ 1.8 V 100 10 ns
VS < 1.8 V 100 20 ns
t(LOW) SCL clock low period VS ≥ 1.8 V 1300 190 ns
VS < 1.8 V 1300 240 ns
t(HIGH) SCL clock high period 600 60 ns
tR(SDA), tF(SDA) Data rise and fall time 300 80 ns
tR(SCL), tF(SCL) Clock rise and fall time 300 40 ns
tR Clock and data rise time for SCLK ≤ 100 kHz 1000 ns