SBOS840 November   2016 TMP75C-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1 Bus Overview
        2. 7.3.3.2 Serial Bus Address
        3. 7.3.3.3 Writing and Reading Operation
        4. 7.3.3.4 Slave Mode Operations
          1. 7.3.3.4.1 Slave Receiver Mode:
          2. 7.3.3.4.2 Slave Transmitter Mode:
        5. 7.3.3.5 High-Speed (Hs) Mode
        6. 7.3.3.6 Timeout Function
        7. 7.3.3.7 Two-Wire Timing
        8. 7.3.3.8 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C5
  • Low-Voltage Alternative to NCT75 and ADT75
  • Digital Output with Two-Wire Serial Interface
  • Up to 8 Pin-Programmable Bus Addresses
  • Overtemperature ALERT Pin with Programmable Trip Values
  • Shutdown Mode for Battery Power Saving
  • One-Shot Conversion Mode
  • Operating Temperature Range: –40°C to +125°C
  • Operating Supply Range: 1.4 V to 3.6 V
  • Quiescent Current:
    15 μA Active (typ), 0.3 μA Shutdown (typ)
  • Accuracy:
    • ±0.25°C (typ) from 0°C to +70°C
    • ±0.5°C (typ) from –20°C to +85°C
    • ±1°C (typ) from –40°C to +125°C
  • Resolution: 12 Bits (0.0625°C)
  • Packages: SOIC-8 and VSSOP-8

2 Applications

  • Server and Computer Thermal Management
  • Telecommunication Equipment
  • Office Machines, Set-Top Boxes,
    Thermostat Controls
  • Video Game Consoles
  • Power Supply and Battery Thermal Protection
  • Environmental Monitoring and HVAC
  • Electrical Motor Driver Thermal Protection

3 Description

The TMP75C-Q1 is an integrated digital temperature sensor with a 12-bit analog-to-digital converter (ADC) that can operate at a 1.8-V supply, and is pin and register compatible with the NCT75 and ADT75. This device is available in SOIC-8 and VSSOP-8 packages and requires no external components to sense the temperature. The TMP75C-Q1 is capable of reading temperatures with a resolution of 0.0625°C and is specified over a temperature range of –40°C to +125°C.

The TMP75C-Q1 features SMBus and two-wire interface compatibility, and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The programmable temperature limits and the ALERT pin allow the sensor to operate as a stand-alone thermostat, or an overtemperature alarm for power throttling or system shutdown.

The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP75C-Q1 the preferred solution for temperature compensation of other sensors and electronic components, without the need for additional system-level calibration or elaborate board layout for distributed temperature sensing.

The TMP75C-Q1 is ideal for thermal management and protection of a variety of consumer, computer, communication, industrial, and environmental applications.

Device Information(1)

DEVICE NAME PACKAGE BODY SIZE (NOM)
TMP75C-Q1 SOIC (8) 4.90 mm × 3.90 mm
VSSOP (8) 3.00 mm × 3.00 mm
  1. For all available packages, see the package option addendum at the end of the datasheet.

Temperature Accuracy (Error) vs Ambient Temperature

TMP75C-Q1 C005_SBOS707.png

Simplified Schematic

TMP75C-Q1 frontpage_sbos840.gif