SBOS840 November   2016 TMP75C-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1 Bus Overview
        2. 7.3.3.2 Serial Bus Address
        3. 7.3.3.3 Writing and Reading Operation
        4. 7.3.3.4 Slave Mode Operations
          1. 7.3.3.4.1 Slave Receiver Mode:
          2. 7.3.3.4.2 Slave Transmitter Mode:
        5. 7.3.3.5 High-Speed (Hs) Mode
        6. 7.3.3.6 Timeout Function
        7. 7.3.3.7 Two-Wire Timing
        8. 7.3.3.8 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VS 4 V
Input voltage SDA, SCL, ALERT, A2, A1 –0.3 4 V
A0 –0.3 (VS) + 0.3 V
Sink current SDA, ALERT 10 mA
Operating junction temperature –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 1.4 1.8 3.6 V
Operating free-air temperature, TA –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP75C-Q1 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 125.4 188.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.5 79.1 °C/W
RθJB Junction-to-board thermal resistance 65.8 109.6 °C/W
ψJT Junction-to-top characterization parameter 21.1 15.3 °C/W
ψJB Junction-to-board characterization parameter 65.3 108 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA = –40°C to +125°C and VS = +1.4 V to +3.6 V, unless otherwise noted. Typical values at TA = 25°C and VS = +1.8 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE INPUT
Temperature range –40 125 °C
Temperature resolution 0.0625 °C
Temperature accuracy (error) 0°C to +70°C ±0.25 ±1 °C
–20°C to +85°C ±0.5 ±2
–40°C to +125°C ±1 ±3
DIGITAL INPUT/OUTPUT
VIH High-level input voltage 0.7(VS) VS V
VIL Low-level input voltage -0.3 0.3(VS) V
IIN Input current 0 V < VIN < (VS) + 0.3 V 1 μA
VOL Low-level output voltage VS ≥ 2 V, IOUT = 3 mA 0.4 V
VS < 2 V, IOUT = 3 mA 0.2(VS)
ADC resolution 12 Bit
Conversion time One-shot mode 20 27 35 ms
Update Rate 80 ms
Bus timeout time 16 22 29 ms
POWER SUPPLY
Operating supply range 1.4 3.6 V
IQ Quiescent current Serial bus inactive 15 37 µA
Serial bus active, SCL frequency = 400 kHz 25
Serial bus active, SCL frequency = 3.4 MHz 95
ISD Shutdown current Serial bus inactive 0.3 8 µA
Serial bus active, SCL frequency = 400 kHz 10
Serial bus active, SCL frequency = 3.4 MHz 80

6.6 Typical Characteristics

At TA = 25°C and VS = +1.8 V (unless otherwise noted).
TMP75C-Q1 C001_SBOS707.png
Figure 1. Quiescent Current vs Temperature
TMP75C-Q1 C003_SBOS707.png
Figure 3. Conversion Time vs Temperature
TMP75C-Q1 C005_SBOS707.png
Figure 5. Temperature Error vs Temperature
TMP75C-Q1 C002_SBOS707.png
Figure 2. Shutdown Current vs Temperature
TMP75C-Q1 C004_SBOS707.png
Figure 4. Quiescent Current vs Bus Frequency
TMP75C-Q1 C006_SBOS707.png
Figure 6. Temperature Error at 25°C