SBOSA26A December   2020  – February 2021 TMP9A00-EP

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Transfer Function
        1. 7.3.1.1 Example 1
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Drive and Capacitive Loads
      2. 8.1.2 Operating Life Deration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Introduction to Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TMP9A00-EP device is a CMOS, precision analog output temperature sensor available in a tiny 5-pin SC70 package. The TMP9A00-EP operates from –55 °C to 150 °C on a supply voltage of 1.8 V to 5.5 V with a supply current of 4 µA. Operation as low as 1.8 V is possible for temperatures between 15 °C and 150 °C. The linear transfer function has a slope of –11.77 mV/°C (typical) and an output voltage of 1.8639 V (typical) at 0 °C. The TMP9A00-EP has a ±2.5 °C accuracy a from –55 °C to 130 °C and ±3.5 °C from 130 °C to 150 °C.

The 4-µA (maximum) supply current of the TMP9A00-EP limits self-heating of the device to less than 0.01 °C. When V+ is less than 0.5 V, the device is in shutdown mode and consumes less than 20 nA (typical).

The TMP9A00-EP is available in a 5-pin SC70 package that reduces the overall required board space.

Device Information
PART NUMBER PACKAGE BODY SIZE (NOM)
TMP9A00-EP SC70 (5) 2.00 mm × 1.25 mm
GUID-030A4005-283E-49A8-B69D-64316C9CC59F-low.gifDevice Block Diagram
GUID-9E5E326F-989D-479E-94B1-09E66DA8B506-low.gifDevice Quiescent Current Over Temperature