SPRS814D March 2012 – October 2019 TMS320C6655 , TMS320C6657
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
Figure 4-1 shows the C665x CZH and GZH ball grid area (BGA) packages (bottom view).
Figure 4-2 shows pin quadrants and Figure 4-3, Figure 4-4, Figure 4-5, and Figure 4-6 show the C665x pin assignments in four quadrants (A, B, C, and D).