SPRS565D April   2009  – June 2014 TMS320C6743

PRODUCTION DATA.  

  1. 1TMS320C6743 Fixed- and Floating-Point Digital Signal Processor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. 3.4.1 C6743 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Terminal Functions
      1. 3.6.1  Device Reset and JTAG
      2. 3.6.2  High-Frequency Oscillator and PLL
      3. 3.6.3  External Memory Interface A (ASYNC)
      4. 3.6.4  External Memory Interface B (SDRAM only)
      5. 3.6.5  Serial Peripheral Interface Modules (SPI0)
      6. 3.6.6  Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)
      7. 3.6.7  Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)
      8. 3.6.8  Enhanced Quadrature Encoder Pulse Module (eQEP)
      9. 3.6.9  Boot
      10. 3.6.10 Universal Asynchronous Receiver/Transmitters (UART0, UART2)
      11. 3.6.11 Inter-Integrated Circuit Modules (I2C0, I2C1)
      12. 3.6.12 Timers
      13. 3.6.13 Multichannel Audio Serial Ports (McASP0, McASP1)
      14. 3.6.14 Ethernet Media Access Controller (EMAC)
      15. 3.6.15 Multimedia Card/Secure Digital (MMC/SD)
      16. 3.6.16 General-Purpose IO Only Terminal Functions
      17. 3.6.17 Reserved and No Connect Terminal Functions
      18. 3.6.18 Supply and Ground Terminal Functions
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Device Operating Conditions
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 PLL Controller 0 Registers
    7. 6.7  DSP Interrupts
    8. 6.8  General-Purpose Input/Output (GPIO)
      1. 6.8.1 GPIO Register Description(s)
      2. 6.8.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-10 Timing Requirements for GPIO Inputs (see )
        2. Table 6-11 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-12 Timing Requirements for External Interrupts (see )
    9. 6.9  EDMA
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Connection Examples
      3. 6.10.3 External Memory Interface (EMIF) Registers
      4. 6.10.4 EMIFA Electrical Data/Timing
        1. Table 6-19 EMIFA Asynchronous Memory Timing Requirements
        2. Table 6-20 EMIFA Asynchronous Memory Switching Characteristics
    11. 6.11 External Memory Interface B (EMIFB)
      1. 6.11.1 EMIFB SDRAM Loading Limitations
      2. 6.11.2 Interfacing to SDRAM
      3. 6.11.3 EMIFB Electrical Data/Timing
        1. Table 6-24 EMIFB SDRAM Interface Timing Requirements
        2. Table 6-25 EMIFB SDRAM Interface Switching Characteristics
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD)
      1. 6.13.1 MMCSD Peripheral Register Description(s)
      2. 6.13.2 MMC/SD Electrical Data/Timing
        1. Table 6-29 Timing Requirements for MMC/SD Module (see and )
        2. Table 6-30 Switching Characteristics Over Recommended Operating Conditions for MMC/SD Module (see through )
    14. 6.14 Ethernet Media Access Controller (EMAC)
      1. 6.14.1 EMAC Peripheral Register Description(s)
      2. 6.14.2 EMAC Electrical Data/Timing
    15. 6.15 Management Data Input/Output (MDIO)
      1. 6.15.1 MDIO Peripheral Register Description(s)
      2. 6.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-38 Timing Requirements for MDIO Input (see and )
        2. Table 6-39 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    16. 6.16 Multichannel Audio Serial Ports (McASP0, McASP1)
      1. 6.16.1 McASP Peripheral Registers Description(s)
      2. 6.16.2 McASP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-44 McASP0 Timing Requirements
          2. Table 6-45 McASP0 Switching Characteristics
        2. 6.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing
          1. Table 6-46 McASP1 Timing Requirements
          2. Table 6-47 McASP1 Switching Characteristics
    17. 6.17 Serial Peripheral Interface Ports (SPI0)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-49 General Timing Requirements for SPI0 Master Modes
          2. Table 6-50 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-51 Additional SPI0 Master Timings, 4-Pin Enable Option
          4. Table 6-52 Additional SPI0 Master Timings, 4-Pin Chip Select Option
          5. Table 6-53 Additional SPI0 Master Timings, 5-Pin Option
          6. Table 6-54 Additional SPI0 Slave Timings, 4-Pin Enable Option
          7. Table 6-55 Additional SPI0 Slave Timings, 4-Pin Chip Select Option
          8. Table 6-56 Additional SPI0 Slave Timings, 5-Pin Option
    18. 6.18 Enhanced Capture (eCAP) Peripheral
      1. Table 6-58 Enhanced Capture (eCAP) Timing Requirement
      2. Table 6-59 eCAP Switching Characteristics
    19. 6.19 Enhanced Quadrature Encoder (eQEP) Peripheral
      1. Table 6-61 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
      2. Table 6-62 eQEP Switching Characteristics
    20. 6.20 Enhanced Pulse Width Modulator (eHRPWM) Modules
      1. 6.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-64 eHRPWM Timing Requirements
        2. Table 6-65 eHRPWM Switching Characteristics
      2. 6.20.2 Trip-Zone Input Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
        1. Table 6-69 Timing Requirements for Timer Input (see )
        2. Table 6-70 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    22. 6.22 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
      1. 6.22.1 I2C Device-Specific Information
      2. 6.22.2 I2C Peripheral Registers Description(s)
      3. 6.22.3 I2C Electrical Data/Timing
        1. 6.22.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-72 I2C Input Timing Requirements
          2. Table 6-73 I2C Switching Characteristics
    23. 6.23 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.23.1 UART Peripheral Registers Description(s)
      2. 6.23.2 UART Electrical Data/Timing
        1. Table 6-75 Timing Requirements for UARTx Receive (see )
        2. Table 6-76 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    24. 6.24 Power and Sleep Controller (PSC)
      1. 6.24.1 PSC Peripheral Registers Description(s)
      2. 6.24.2 Power Domain and Module Topology
        1. 6.24.2.1 Power Domain States
        2. 6.24.2.2 Module States
    25. 6.25 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.25.1 PRUSS Register Descriptions
    26. 6.26 Emulation Logic
      1. 6.26.1 JTAG Port Description
      2. 6.26.2 Scan Chain Configuration Parameters
      3. 6.26.3 JTAG 1149.1 Boundary Scan Considerations
    27. 6.27 IEEE 1149.1 JTAG
      1. 6.27.1 JTAG Peripheral Register Description(s) – JTAG ID Register
      2. 6.27.2 JTAG Test-Port Electrical Data/Timing
        1. Table 6-91 Timing Requirements for JTAG Test Port (see )
        2. Table 6-92 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZKB
    2. 8.2 Thermal Data for PTP
    3. 8.3 Supplementary Information About the 176-pin PTP PowerPAD™ Package
      1. 8.3.1 Standoff Height
      2. 8.3.2 PowerPAD™ PCB Footprint
    4. 8.4 Mechanical Drawings

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZKB|256
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3.1 Device Characteristics

Table 3-1 provides an overview of the C6743 Low power digital signal processor. The table shows significant features of the device, including the capacity of on-chip RAM, peripherals, and the package type with pin count.

Table 3-1 Characteristics of the C6743 Processor

HARDWARE FEATURES C6743
Peripherals


Not all peripherals pins are available at the same time (for more detail, see the Device Configurations section). 		EMIFB SDRAM only, 16-bit bus width, up to 128 MB (PTP) SDRAM only, 16-bit bus width, up to 128 MB (ZKB)
EMIFA Asynchronous (8-bit bus width) RAM, Flash, NOR, NAND
Flash Card Interface MMC and SD cards supported.
EDMA3 32 independent channels, 8 QDMA channels, 2 Transfer controllers
Timers 2 64-Bit General Purpose (configurable as 2 separate 32-bit timers, 1 configurable as Watch Dog)
UART 2 (One with RTS and CTS flow control)
SPI One with one hardware chip select
I2C 2 (both Master/Slave)
Multichannel Audio Serial Port [McASP] 2 (each with transmit/receive, FIFO buffer, 14/9 serializers)
10/100 Ethernet MAC with Management Data I/O 1 (RMII Interface)
eHRPWM 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
eCAP 3 32-bit capture inputs or 3 32-bit auxiliary PWM outputs
eQEP 2 32-bit QEP channels with 4 inputs/channel
General-Purpose Input/Output Port 8 banks of 16-bit
PRU Subsystem (PRUSS) 2 Programmable PRU Cores
On-Chip Memory Size (Bytes) 320KB RAM
Organization DSP
32KB L1 Program (L1P)/Cache (up to 32KB)
32KB L1 Data (L1D)/Cache (up to 32KB)
128KB Unified Mapped RAM/Cache (L2)
DSP Memories can be made accessible to EDMA3, and other peripherals.
C674x CPU ID + CPU Rev ID Control Status Register (CSR.[31:16]) 0x1400
C674x Megamodule Revision Revision ID Register (MM_REVID[15:0]) 0x0000
JTAG BSDL_ID DEVIDR0 register 0x8B7DF02F (Silicon Revision 1.0)
0x8B7DF02F (Silicon Revision 1.1)
0x9B7DF02F (Silicon Revision 3.0, 2.1, and 2.0)
CPU Frequency MHz C674x DSP 375(/200) MHz
Voltage Core (V) 1.2 V
I/O (V) 3.3 V
Package 24 mm x 24 mm, 176-Pin, 0.5 mm pitch, TQFP (PTP) 17 mm x 17 mm, 256-Ball 1 mm pitch, PBGA (ZKB)
Product Status(1) Product Preview (PP),
Advance Information (AI),
or Production Data (PD)		 PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.