SPRS565D April   2009  – June 2014 TMS320C6743

PRODUCTION DATA.  

  1. 1TMS320C6743 Fixed- and Floating-Point Digital Signal Processor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. 3.4.1 C6743 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Terminal Functions
      1. 3.6.1  Device Reset and JTAG
      2. 3.6.2  High-Frequency Oscillator and PLL
      3. 3.6.3  External Memory Interface A (ASYNC)
      4. 3.6.4  External Memory Interface B (SDRAM only)
      5. 3.6.5  Serial Peripheral Interface Modules (SPI0)
      6. 3.6.6  Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)
      7. 3.6.7  Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)
      8. 3.6.8  Enhanced Quadrature Encoder Pulse Module (eQEP)
      9. 3.6.9  Boot
      10. 3.6.10 Universal Asynchronous Receiver/Transmitters (UART0, UART2)
      11. 3.6.11 Inter-Integrated Circuit Modules (I2C0, I2C1)
      12. 3.6.12 Timers
      13. 3.6.13 Multichannel Audio Serial Ports (McASP0, McASP1)
      14. 3.6.14 Ethernet Media Access Controller (EMAC)
      15. 3.6.15 Multimedia Card/Secure Digital (MMC/SD)
      16. 3.6.16 General-Purpose IO Only Terminal Functions
      17. 3.6.17 Reserved and No Connect Terminal Functions
      18. 3.6.18 Supply and Ground Terminal Functions
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Device Operating Conditions
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 PLL Controller 0 Registers
    7. 6.7  DSP Interrupts
    8. 6.8  General-Purpose Input/Output (GPIO)
      1. 6.8.1 GPIO Register Description(s)
      2. 6.8.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-10 Timing Requirements for GPIO Inputs (see )
        2. Table 6-11 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-12 Timing Requirements for External Interrupts (see )
    9. 6.9  EDMA
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Connection Examples
      3. 6.10.3 External Memory Interface (EMIF) Registers
      4. 6.10.4 EMIFA Electrical Data/Timing
        1. Table 6-19 EMIFA Asynchronous Memory Timing Requirements
        2. Table 6-20 EMIFA Asynchronous Memory Switching Characteristics
    11. 6.11 External Memory Interface B (EMIFB)
      1. 6.11.1 EMIFB SDRAM Loading Limitations
      2. 6.11.2 Interfacing to SDRAM
      3. 6.11.3 EMIFB Electrical Data/Timing
        1. Table 6-24 EMIFB SDRAM Interface Timing Requirements
        2. Table 6-25 EMIFB SDRAM Interface Switching Characteristics
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD)
      1. 6.13.1 MMCSD Peripheral Register Description(s)
      2. 6.13.2 MMC/SD Electrical Data/Timing
        1. Table 6-29 Timing Requirements for MMC/SD Module (see and )
        2. Table 6-30 Switching Characteristics Over Recommended Operating Conditions for MMC/SD Module (see through )
    14. 6.14 Ethernet Media Access Controller (EMAC)
      1. 6.14.1 EMAC Peripheral Register Description(s)
      2. 6.14.2 EMAC Electrical Data/Timing
    15. 6.15 Management Data Input/Output (MDIO)
      1. 6.15.1 MDIO Peripheral Register Description(s)
      2. 6.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-38 Timing Requirements for MDIO Input (see and )
        2. Table 6-39 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    16. 6.16 Multichannel Audio Serial Ports (McASP0, McASP1)
      1. 6.16.1 McASP Peripheral Registers Description(s)
      2. 6.16.2 McASP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-44 McASP0 Timing Requirements
          2. Table 6-45 McASP0 Switching Characteristics
        2. 6.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing
          1. Table 6-46 McASP1 Timing Requirements
          2. Table 6-47 McASP1 Switching Characteristics
    17. 6.17 Serial Peripheral Interface Ports (SPI0)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-49 General Timing Requirements for SPI0 Master Modes
          2. Table 6-50 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-51 Additional SPI0 Master Timings, 4-Pin Enable Option
          4. Table 6-52 Additional SPI0 Master Timings, 4-Pin Chip Select Option
          5. Table 6-53 Additional SPI0 Master Timings, 5-Pin Option
          6. Table 6-54 Additional SPI0 Slave Timings, 4-Pin Enable Option
          7. Table 6-55 Additional SPI0 Slave Timings, 4-Pin Chip Select Option
          8. Table 6-56 Additional SPI0 Slave Timings, 5-Pin Option
    18. 6.18 Enhanced Capture (eCAP) Peripheral
      1. Table 6-58 Enhanced Capture (eCAP) Timing Requirement
      2. Table 6-59 eCAP Switching Characteristics
    19. 6.19 Enhanced Quadrature Encoder (eQEP) Peripheral
      1. Table 6-61 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
      2. Table 6-62 eQEP Switching Characteristics
    20. 6.20 Enhanced Pulse Width Modulator (eHRPWM) Modules
      1. 6.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-64 eHRPWM Timing Requirements
        2. Table 6-65 eHRPWM Switching Characteristics
      2. 6.20.2 Trip-Zone Input Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
        1. Table 6-69 Timing Requirements for Timer Input (see )
        2. Table 6-70 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    22. 6.22 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
      1. 6.22.1 I2C Device-Specific Information
      2. 6.22.2 I2C Peripheral Registers Description(s)
      3. 6.22.3 I2C Electrical Data/Timing
        1. 6.22.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-72 I2C Input Timing Requirements
          2. Table 6-73 I2C Switching Characteristics
    23. 6.23 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.23.1 UART Peripheral Registers Description(s)
      2. 6.23.2 UART Electrical Data/Timing
        1. Table 6-75 Timing Requirements for UARTx Receive (see )
        2. Table 6-76 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    24. 6.24 Power and Sleep Controller (PSC)
      1. 6.24.1 PSC Peripheral Registers Description(s)
      2. 6.24.2 Power Domain and Module Topology
        1. 6.24.2.1 Power Domain States
        2. 6.24.2.2 Module States
    25. 6.25 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.25.1 PRUSS Register Descriptions
    26. 6.26 Emulation Logic
      1. 6.26.1 JTAG Port Description
      2. 6.26.2 Scan Chain Configuration Parameters
      3. 6.26.3 JTAG 1149.1 Boundary Scan Considerations
    27. 6.27 IEEE 1149.1 JTAG
      1. 6.27.1 JTAG Peripheral Register Description(s) – JTAG ID Register
      2. 6.27.2 JTAG Test-Port Electrical Data/Timing
        1. Table 6-91 Timing Requirements for JTAG Test Port (see )
        2. Table 6-92 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZKB
    2. 8.2 Thermal Data for PTP
    3. 8.3 Supplementary Information About the 176-pin PTP PowerPAD™ Package
      1. 8.3.1 Standoff Height
      2. 8.3.2 PowerPAD™ PCB Footprint
    4. 8.4 Mechanical Drawings

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZKB|256
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

This data manual revision history highlights the changes made to the SPRS565C device-specific data manual to make it an SPRS565D revision.

Table 2-1 Revision History

SEE ADDITIONS/MODIFICATIONS/DELETIONS
Global
  • Updated Features, Applications, and Description for consistency and translation.
  • Moved Trademarks information from first page to within Section 7, Device and Documentation Support.
  • Moved ESDS Warning to within Section 7, Device and Documentation Support.
Section 1.1
Features		 Deleted Highlights section. Information was duplicated elsewhere in Features.
Section 1.2
Applications		 Added NEW section.
Section 1.3
Description		 Added NEW Device Information Table.
Section 1.4
Functional Block Diagram		 Updated/Changed text before FBD from "...block diagram of TMS320C6747..." to "...block diagram of TMS320C6743..."
Figure 1-1, TMS320C6743 Functional Block Diagram:
  • Added PRU Subsystem block
Section 3.3.2.3
C674x CPU		 Table 3-2, C674x Cache Registers:
  • Updated/Changed REGISTER DESCRIPTION for BYTE ADDRESSES 0000, 0020, and 0040 with "(See the Technical Reference Manual..."
Section 3.6.17
Reserved and No Connect Terminal Functions		 Table 3-20, Reserved and No Connect Terminal Functions:
  • Updated/Changed RSV4 DESCRIPTION from "...This pin may be tied high or low." to "...For proper device operation, this pin must be tied low or to CVDD."
Section 4
Device Configuration		 Section 4.2, SYSCFG Module:
  • Deleted bullet "A special key sequence must be written to KICK0, KICK1..."
Section 5
Device Operating Conditions		 Section 5.2, Handling Ratings:
  • Split handling, ratings, and certifications from the Abs Max table and placed in NEW Handling Ratings table.
Section 5.4
Notes on Recommended Power-On Hours (POH)		 Table 5-1, Recommended Power-On Hours:
  • Added Silicon Revision column.
Section 6.10.4
EMIFA Electrical Data/Timing		 Table 6-20, EMIFA Asynchronous Memory Switching Characteristics;
  • Updated/Changed the MIN, NOM, and MAX equations for NO. 3, 10, 15, and 24 from "...(EWC*16)..." to "...EWC..."
Section 6.11.3
EMIFB Electrical Data/Timing		 Table 6-25, EMIFB SDRAM Interface Switching Characteristics:
  • Added new column "Commercial (Default) Temperature Range". Existing column became "Automotive Temperature Range"
  • Updated/Changed PARAMETER No. 1 MIN for Automotive from "6.579" to "7.5"
  • Updated/Changed PARAMETER No. 2 MIN for Automotive from "2.63" to "3"
Section 6.16
Multichannel Audio Serial Ports (McASP0, McASP1)		 Table 6-42, McASP Registers Accessed Through DMA Port:
  • Updated/Changed Read Accesses Register Description from "XBUSEL = 0 in XFMT" to "RBUSEL = 0 in RFMT"
  • Updated/Changed Write Accesses Register Description from "RBUSEL = 0 in RFMT" to "XBUSEL = 0 in XFMT"
Section 7.2
Documentation Support		 Updated/Changed "SPRUGJ0 TMS320C6743 DSP System Reference Guide" to "SPRUH90 TMS320C6743 DSP Technical Reference Manual"
Section 7.3
Community Resources		 Added NEW section.
Section 7.6
Glossary		 Added NEW section.