SPRS614F March   2011  – March 2015 TMS320DM8165 , TMS320DM8167 , TMS320DM8168

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 ARM Subsystem
      1. 3.2.1 ARM Cortex-A8 RISC Processor
      2. 3.2.2 Embedded Trace Module (ETM)
      3. 3.2.3 ARM Cortex-A8 Interrupt Controller (AINTC)
      4. 3.2.4 System Interconnect
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 System Memory Management Unit (System MMU)
        1. 3.3.2.1 System MMU Registers
    4. 3.4 Media Controller
    5. 3.5 High-Definition Video Image Coprocessor 2 (HDVICP2)
    6. 3.6 Inter-Processor Communication
      1. 3.6.1 Mailbox Module
        1. 3.6.1.1 Mailbox Registers
      2. 3.6.2 Spinlock Module
        1. 3.6.2.1 Spinlock Registers
    7. 3.7 Power, Reset and Clock Management (PRCM) Module
    8. 3.8 SGX530 (DM8168 only)
    9. 3.9 Memory Map Summary
      1. 3.9.1 L3 Memory Map
      2. 3.9.2 L4 Memory Map
        1. 3.9.2.1 L4 Standard Peripheral
        2. 3.9.2.2 L4 High-Speed Peripheral
      3. 3.9.3 TILER Extended Addressing Map
      4. 3.9.4 Cortex™-A8 Memory Map
      5. 3.9.5 C674x Memory Map
  4. 4 Terminal Configuration and Functions
    1. 4.1 Pin Assignments
      1. 4.1.1 Pin Map (Bottom View)
    2. 4.2 Terminal Functions
      1. 4.2.1  Boot Configuration
      2. 4.2.2  DDR2 and DDR3 Memory Controller Signals
      3. 4.2.3  Ethernet Media Access Controller (EMAC) Signals
      4. 4.2.4  General-Purpose Input/Output (GPIO) Signals
      5. 4.2.5  General-Purpose Memory Controller (GPMC) Signals
      6. 4.2.6  High-Definition Multimedia Interface (HDMI) Signals
      7. 4.2.7  Inter-Integrated Circuit (I2C) Signals
      8. 4.2.8  Multichannel Audio Serial Port Signals
      9. 4.2.9  Multichannel Buffered Serial Port Signals
      10. 4.2.10 Oscillator/Phase-Locked Loop (PLL) Signals
      11. 4.2.11 Peripheral Component Interconnect Express (PCIe) Signals
      12. 4.2.12 Reset, Interrupts, and JTAG Interface Signals
      13. 4.2.13 Secure Digital/Secure Digital Input Output (SD/SDIO) Signals
      14. 4.2.14 Serial ATA Signals
      15. 4.2.15 Serial Peripheral Digital Interconnect Format (SPI) Signals
      16. 4.2.16 Timer Signals
      17. 4.2.17 Universal Asynchronous Receiver/Transmitter (UART) Signals
      18. 4.2.18 Universal Serial Bus (USB) Signals
      19. 4.2.19 Video Input Signals
      20. 4.2.20 Digital Video Output Signals
      21. 4.2.21 Analog Video Output Signals
      22. 4.2.22 Reserved Pins
      23. 4.2.23 Supply Voltages
      24. 4.2.24 Ground Pins (VSS)
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings (Unless Otherwise Noted)
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Resistance Characteristics
  6. 6 Device Configurations
    1. 6.1 Control Module
    2. 6.2 Revision Identification
    3. 6.3 Debugging Considerations
      1. 6.3.1 Pullup and Pulldown Resistors
    4. 6.4 Boot Sequence
      1. 6.4.1 Boot Mode Registers
    5. 6.5 Pin Multiplexing Control
      1. 6.5.1 PINCTRLx Register Descriptions
    6. 6.6 How to Handle Unused Pins
  7. 7 System Interconnect
    1. 7.1 L3 Interconnect
    2. 7.2 L4 Interconnect
  8. 8 Power, Reset, Clocking, and Interrupts
    1. 8.1 Power Supplies
      1. 8.1.1 Voltage and Power Domains
      2. 8.1.2 Power Domains
      3. 8.1.3 1-V AVS and 1-V Constant Power Domains
      4. 8.1.4 SmartReflex™
      5. 8.1.5 Memory Power Management
      6. 8.1.6 IO Power-Down Modes
      7. 8.1.7 Supply Sequencing
      8. 8.1.8 Power-Supply Decoupling
    2. 8.2 Reset
      1. 8.2.1  System-Level Reset Sources
      2. 8.2.2  Power-On Reset (POR pin)
      3. 8.2.3  External Warm Reset (RESET pin)
      4. 8.2.4  Emulation Warm Reset
      5. 8.2.5  Watchdog Reset
      6. 8.2.6  Software Global Cold Reset
      7. 8.2.7  Software Global Warm Reset
      8. 8.2.8  Test Reset (TRST pin)
      9. 8.2.9  Local Reset
      10. 8.2.10 Reset Priority
      11. 8.2.11 Reset Status Register
      12. 8.2.12 PCIe Reset Isolation
      13. 8.2.13 RSTOUT
      14. 8.2.14 Effect of Reset on Emulation and Trace
      15. 8.2.15 Reset During Power Domain Switching
      16. 8.2.16 Pin Behaviors at Reset
      17. 8.2.17 Reset Electrical Data and Timing
    3. 8.3 Clocking
      1. 8.3.1 Device Clock Inputs
        1. 8.3.1.1 Using the Internal Oscillators
      2. 8.3.2 SERDES_CLKN and SERDES_CLKP Input Clock
      3. 8.3.3 CLKIN32 Input Clock
      4. 8.3.4 PLLs
        1. 8.3.4.1 PLL Programming Limits
        2. 8.3.4.2 PLL Power Supply Filtering
        3. 8.3.4.3 PLL Locking Sequence
        4. 8.3.4.4 PLL Registers
      5. 8.3.5 SYSCLKs
      6. 8.3.6 Module Clocks
      7. 8.3.7 Output Clock Select Logic
    4. 8.4 Interrupts
      1. 8.4.1 Interrupt Summary List
      2. 8.4.2 Cortex™-A8 Interrupts
      3. 8.4.3 C674x Interrupts
  9. 9 Peripheral Information and Timings
    1. 9.1  Parameter Information
      1. 9.1.1 1.8-V and 3.3-V Signal Transition Levels
      2. 9.1.2 3.3-V Signal Transition Rates
      3. 9.1.3 Timing Parameters and Board Routing Analysis
    2. 9.2  Recommended Clock and Control Signal Transition Behavior
    3. 9.3  DDR2 and DDR3 Memory Controller
      1. 9.3.1 DDR2 Routing Specifications
        1. 9.3.1.1 Board Designs
        2. 9.3.1.2 DDR2 Interface
          1. 9.3.1.2.1  DDR2 Interface Schematic
          2. 9.3.1.2.2  Compatible JEDEC DDR2 Devices
          3. 9.3.1.2.3  PCB Stackup
          4. 9.3.1.2.4  Placement
          5. 9.3.1.2.5  DDR2 Keepout Region
          6. 9.3.1.2.6  Bulk Bypass Capacitors
          7. 9.3.1.2.7  High-Speed Bypass Capacitors
          8. 9.3.1.2.8  Net Classes
          9. 9.3.1.2.9  DDR2 Signal Termination
          10. 9.3.1.2.10 VREFSSTL_DDR Routing
        3. 9.3.1.3 DDR2 CK and ADDR_CTRL Routing
      2. 9.3.2 DDR3 Routing Specifications
        1. 9.3.2.1  Board Designs
          1. 9.3.2.1.1 DDR3 versus DDR2
        2. 9.3.2.2  DDR3 Device Combinations
          1. 9.3.2.2.1 DDR3 EMIFs
        3. 9.3.2.3  DDR3 Interface Schematic
          1. 9.3.2.3.1 32-Bit DDR3 Interface
          2. 9.3.2.3.2 16-Bit DDR3 Interface
        4. 9.3.2.4  Compatible JEDEC DDR3 Devices
        5. 9.3.2.5  PCB Stackup
        6. 9.3.2.6  Placement
        7. 9.3.2.7  DDR3 Keepout Region
        8. 9.3.2.8  Bulk Bypass Capacitors
        9. 9.3.2.9  High-Speed Bypass Capacitors
          1. 9.3.2.9.1 Return Current Bypass Capacitors
        10. 9.3.2.10 Net Classes
        11. 9.3.2.11 DDR3 Signal Termination
        12. 9.3.2.12 VREFSSTL_DDR Routing
        13. 9.3.2.13 VTT
        14. 9.3.2.14 CK and ADDR_CTRL Topologies and Routing Definition
          1. 9.3.2.14.1 Four DDR3 Devices
            1. 9.3.2.14.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 9.3.2.14.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 9.3.2.14.2 Two DDR3 Devices
            1. 9.3.2.14.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 9.3.2.14.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 9.3.2.14.3 One DDR3 Device
            1. 9.3.2.14.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 9.3.2.14.3.2 CK and ADDR_CTRL Routing, One DDR3 Device
        15. 9.3.2.15 Data Topologies and Routing Definition
          1. 9.3.2.15.1 DQS, DQ and DM Topologies, Any Number of Allowed DDR3 Devices
          2. 9.3.2.15.2 DQS, DQ and DM Routing, Any Number of Allowed DDR3 Devices
        16. 9.3.2.16 Routing Specification
          1. 9.3.2.16.1 CK and ADDR_CTRL Routing Specification
          2. 9.3.2.16.2 DQS and DQ Routing Specification
      3. 9.3.3 DDR2 and DDR3 Memory Controller Register Descriptions
      4. 9.3.4 DDR2 and DDR3 PHY Register Descriptions
      5. 9.3.5 DDR2 and DDR3 Memory Controller Electrical Data and Timing
    4. 9.4  Emulation Features and Capability
      1. 9.4.1 Advanced Event Triggering (AET)
      2. 9.4.2 Trace
      3. 9.4.3 IEEE 1149.1 JTAG
        1. 9.4.3.1 JTAG ID (JTAGID) Register Description
        2. 9.4.3.2 JTAG Electrical Data and Timing
      4. 9.4.4 IEEE 1149.7 cJTAG
    5. 9.5  Enhanced Direct Memory Access (EDMA) Controller
      1. 9.5.1 EDMA Channel Synchronization Events
      2. 9.5.2 EDMA Peripheral Register Descriptions
    6. 9.6  Ethernet Media Access Controller (EMAC)
      1. 9.6.1 EMAC Peripheral Register Descriptions
      2. 9.6.2 EMAC Electrical Data and Timing
      3. 9.6.3 Management Data Input and Output (MDIO)
        1. 9.6.3.1 MDIO Peripheral Register Descriptions
        2. 9.6.3.2 MDIO Electrical Data and Timing
    7. 9.7  General-Purpose Input and Output (GPIO)
      1. 9.7.1 GPIO Peripheral Register Descriptions
      2. 9.7.2 GPIO Electrical Data and Timing
    8. 9.8  General-Purpose Memory Controller (GPMC) and Error Locator Module (ELM)
      1. 9.8.1 GPMC and ELM Peripheral Register Descriptions
      2. 9.8.2 GPMC Electrical Data and Timing
        1. 9.8.2.1 GPMC and NOR Flash Interface Synchronous Mode Timing
        2. 9.8.2.2 GPMC and NOR Flash Interface Asynchronous Mode Timing
        3. 9.8.2.3 GPMC and NAND Flash Interface Asynchronous Mode Timing
    9. 9.9  High-Definition Multimedia Interface (HDMI)
      1. 9.9.1 HDMI Interface Design Specifications
        1. 9.9.1.1 HDMI Interface Schematic
        2. 9.9.1.2 TMDS Routing
        3. 9.9.1.3 DDC Signals
        4. 9.9.1.4 HDMI ESD Protection Device (Required)
        5. 9.9.1.5 PCB Stackup Specifications
        6. 9.9.1.6 Grounding
      2. 9.9.2 HDMI Peripheral Register Descriptions
    10. 9.10 High-Definition Video Processing Subsystem (HDVPSS)
      1. 9.10.1 HDVPSS Electrical Data and Timing
      2. 9.10.2 Video DAC Guidelines and Electrical Data and Timing
    11. 9.11 Inter-Integrated Circuit (I2C)
      1. 9.11.1 I2C Peripheral Register Descriptions
      2. 9.11.2 I2C Electrical Data and Timing
    12. 9.12 Multichannel Audio Serial Port (McASP)
      1. 9.12.1 McASP Device-Specific Information
      2. 9.12.2 McASP0, McASP1, and McASP2 Peripheral Register Descriptions
      3. 9.12.3 McASP Electrical Data and Timing
    13. 9.13 Multichannel Buffered Serial Port (McBSP)
      1. 9.13.1 McBSP Peripheral Registers
      2. 9.13.2 McBSP Electrical Data and Timing
    14. 9.14 Peripheral Component Interconnect Express (PCIe)
      1. 9.14.1 PCIe Design and Layout Specifications
        1. 9.14.1.1 Clock Source
        2. 9.14.1.2 PCIe Connections and Interface Compliance
          1. 9.14.1.2.1 Coupling Capacitors
          2. 9.14.1.2.2 Polarity Inversion
          3. 9.14.1.2.3 Lane Reversal
        3. 9.14.1.3 Non-Standard PCIe Connections
          1. 9.14.1.3.1 PCB Stackup Specifications
          2. 9.14.1.3.2 Routing Specifications
      2. 9.14.2 PCIe Peripheral Register Descriptions
      3. 9.14.3 PCIe Electrical Data and Timing
    15. 9.15 Real-Time Clock (RTC)
      1. 9.15.1 RTC Register Descriptions
    16. 9.16 Secure Digital and Secure Digital Input Output (SD and SDIO)
      1. 9.16.1 SD and SDIO Peripheral Register Descriptions
      2. 9.16.2 SD and SDIO Electrical Data and Timing
        1. 9.16.2.1 SD Identification and Standard SD Mode
        2. 9.16.2.2 High-Speed SD Mode
    17. 9.17 Serial ATA Controller (SATA)
      1. 9.17.1 SATA Interface Design Specifications
        1. 9.17.1.1 SATA Interface Schematic
        2. 9.17.1.2 Compatible SATA Components and Modes
        3. 9.17.1.3 PCB Stackup Specifications
        4. 9.17.1.4 Routing Specifications
        5. 9.17.1.5 Coupling Capacitors
      2. 9.17.2 SATA Peripheral Register Descriptions
    18. 9.18 Serial Peripheral Interface (SPI)
      1. 9.18.1 SPI Peripheral Register Descriptions
      2. 9.18.2 SPI Electrical Data and Timing
    19. 9.19 Timers
      1. 9.19.1 Timer Peripheral Register Descriptions
      2. 9.19.2 Timer Electrical Data and Timing
    20. 9.20 Universal Asynchronous Receiver and Transmitter (UART)
      1. 9.20.1 UART Peripheral Register Descriptions
      2. 9.20.2 UART Electrical Data and Timing
    21. 9.21 Universal Serial Bus (USB2.0)
      1. 9.21.1 USB2.0 Peripheral Register Descriptions
      2. 9.21.2 USB2.0 Electrical Data and Timing
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
      2. 10.1.2 Device Speed Range Overview
    2. 10.2 Documentation Support
    3. 10.3 Related Links
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical Packaging and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • CYG|1031
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Device Support

10.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of TMS320DM816x processor applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++ and Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software DSP/BIOS™, which provides the basic run-time target software needed to support any DaVinci Video Processor application.

Hardware Development Tools: Extended Development System (XDS™) Emulator

For a complete listing of development-support tools for the DM816x DaVinci™ Video Processor platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Device and Development Support-Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320DM8168CYG). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS).

Device development evolutionary flow:

    TMXExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMPPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMSProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, CYG), the temperature range (for example, blank is the default commercial operating junction temperature range), and the device speed range (for example, blank is the default [930-MHz ARM, 750-MHz DSP]). Figure 10-1 provides a legend for reading the complete device name for any TMS320DM816x device. For a comparison of device features, see Table 3-1.

For device part numbers and further ordering information of TMS320DM816x devices in the CYG package type, see the TI website (www.ti.com) or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the TMS320DM816x DaVinci Digital Media ProcessorsSilicon Errata (literature number SPRZ329).

TMS320DM8168 TMS320DM8167 TMS320DM8165 dev_nomen_sprs614.gif
A. BGA = Ball-Grid Array.
Figure 10-1 Device Nomenclature

10.1.2 Device Speed Range Overview

Table 10-1 specifies all clock frequencies with respect to device speed range.

Table 10-1 Device Speed Ranges

PART NUMBER ARM (MHz) DSP (MHz) HDVICP2 (MHz) SGX530 (MHz) Media Controller (M3) (MHz) DDR3 (MTps) DDR2 (MTps) EMIF (MHz) DMM (MHz)
CYG 930 750 500 310 230 1600 1066 400 364
CYG2 1100 930 550 275 275 1600 1066 400 364
CYGA2
CYG4 1200 1000 630 300 285 1600 1066 400 425

10.2 Documentation Support

The following documents describe the DM816x DaVinci™ Video Processors. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box.

    SPRUGX8TMS320DM816x Digital Media Processors Technical Reference Manual details the integrations, the environment, the functional description, and the programming models for each peripheral and subsystem in the device.
    SPRZ329TMS320DM816x DaVinci™ Digital Media Processors describes the usage notes and known exceptions to the functional specifications for the device.
    SPRABK6DM816xx Easy CYG Package PCB Escape Routing.

10.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 10-2 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TMS320DM8168 Click here Click here Click here Click here Click here
TMS320DM8167 Click here Click here Click here Click here Click here
TMS320DM8165 Click here Click here Click here Click here Click here

10.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

10.5 Trademarks

Code Composer Studio, DSP/BIOS, XDS, DaVinci, E2E are trademarks of Texas Instruments.

Cortex, NEON are trademarks of ARM Limited.

Jazelle is a registered trademark of ARM Limited.

Thumb is a registered trademark of ARM Ltd or its subsidiaries.

PowerVR is a registered trademark of Imagination Technologies Limited.

OpenVG, OpenMax are trademarks of Khronos, Group Inc..

OpenGL is a registered trademark of Khronos, Group Inc..

Microsoft, Windows are registered trademarks of Microsoft Corp.

Direct3D is a registered trademark of Microsoft.

I2C bus is a registered trademark of NXP B.V. Corporation Netherlands.

PCI Express is a registered trademark of PCI-SIG.

C674x, C64x+, SmartReflex, TMS320C6000 are trademarks of TI.

Via Channel is a trademark of Via Technologies, Inc..

10.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.