SPRSP45C March   2020  – April 2024 TMS320F280021 , TMS320F280021-Q1 , TMS320F280023 , TMS320F280023-Q1 , TMS320F280023C , TMS320F280025 , TMS320F280025-Q1 , TMS320F280025C , TMS320F280025C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Analog Signals
      2. 5.3.2 Digital Signals
      3. 5.3.3 Power and Ground
      4. 5.3.4 Test, JTAG, and Reset
    4. 5.4 Pin Multiplexing
      1. 5.4.1 GPIO Muxed Pins
        1. 5.4.1.1 GPIO Muxed Pins Table
      2. 5.4.2 Digital Inputs on ADC Pins (AIOs)
      3. 5.4.3 GPIO Input X-BAR
      4. 5.4.4 GPIO Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR
    5. 5.5 Pins With Internal Pullup and Pulldown
    6. 5.6 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  ESD Ratings – Automotive
    4. 6.4  Recommended Operating Conditions
    5.     Supply Voltages
    6. 6.5  Power Consumption Summary
      1. 6.5.1 System Current Consumption
      2. 6.5.2 Operating Mode Test Description
      3. 6.5.3 Current Consumption Graphs
      4. 6.5.4 Reducing Current Consumption
        1. 6.5.4.1 Typical Current Reduction per Disabled Peripheral
    7. 6.6  Electrical Characteristics
    8. 6.7  Thermal Resistance Characteristics for PN Package
    9. 6.8  Thermal Resistance Characteristics for PM Package
    10. 6.9  Thermal Resistance Characteristics for PT Package
    11. 6.10 Thermal Design Considerations
    12. 6.11 System
      1. 6.11.1  Power Management Module (PMM)
        1. 6.11.1.1 Introduction
        2. 6.11.1.2 Overview
          1. 6.11.1.2.1 Power Rail Monitors
            1. 6.11.1.2.1.1 I/O POR (Power-On Reset) Monitor
            2. 6.11.1.2.1.2 I/O BOR (Brown-Out Reset) Monitor
            3. 6.11.1.2.1.3 VDD POR (Power-On Reset) Monitor
          2. 6.11.1.2.2 External Supervisor Usage
          3. 6.11.1.2.3 Delay Blocks
          4. 6.11.1.2.4 Internal 1.2-V LDO Voltage Regulator (VREG)
        3. 6.11.1.3 External Components
          1. 6.11.1.3.1 Decoupling Capacitors
            1. 6.11.1.3.1.1 VDDIO Decoupling
            2. 6.11.1.3.1.2 VDD Decoupling
        4. 6.11.1.4 Power Sequencing
          1. 6.11.1.4.1 Supply Pins Ganging
          2. 6.11.1.4.2 Signal Pins Power Sequence
          3. 6.11.1.4.3 Supply Pins Power Sequence
            1. 6.11.1.4.3.1 Internal VREG/VDD Mode Sequence
            2. 6.11.1.4.3.2 Supply Sequencing Summary and Effects of Violations
            3. 6.11.1.4.3.3 Supply Slew Rate
        5. 6.11.1.5 Power Management Module Electrical Data and Timing
          1. 6.11.1.5.1 Power Management Module Characteristics
          2. 6.11.1.5.2 Power Management Module Operating Conditions
      2. 6.11.2  Reset Timing
        1. 6.11.2.1 Reset Sources
        2. 6.11.2.2 Reset Electrical Data and Timing
          1. 6.11.2.2.1 Reset (XRSn) Timing Requirements
          2. 6.11.2.2.2 Reset (XRSn) Switching Characteristics
          3. 6.11.2.2.3 Reset Timing Diagrams
      3. 6.11.3  Clock Specifications
        1. 6.11.3.1 Clock Sources
        2. 6.11.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.11.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.11.3.2.1.1 Input Clock Frequency
            2. 6.11.3.2.1.2 XTAL Oscillator Characteristics
            3. 6.11.3.2.1.3 X1 Timing Requirements
            4. 6.11.3.2.1.4 APLL Characteristics
            5. 6.11.3.2.1.5 XCLKOUT Switching Characteristics
            6. 6.11.3.2.1.6 Internal Clock Frequencies
        3. 6.11.3.3 Input Clocks and PLLs
        4. 6.11.3.4 XTAL Oscillator
          1. 6.11.3.4.1 Introduction
          2. 6.11.3.4.2 Overview
            1. 6.11.3.4.2.1 Electrical Oscillator
              1. 6.11.3.4.2.1.1 Modes of Operation
                1. 6.11.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.11.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.11.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.11.3.4.2.2 Quartz Crystal
            3. 6.11.3.4.2.3 GPIO Modes of Operation
          3. 6.11.3.4.3 Functional Operation
            1. 6.11.3.4.3.1 ESR – Effective Series Resistance
            2. 6.11.3.4.3.2 Rneg – Negative Resistance
            3. 6.11.3.4.3.3 Start-up Time
            4. 6.11.3.4.3.4 DL – Drive Level
          4. 6.11.3.4.4 How to Choose a Crystal
          5. 6.11.3.4.5 Testing
          6. 6.11.3.4.6 Common Problems and Debug Tips
          7. 6.11.3.4.7 Crystal Oscillator Specifications
            1. 6.11.3.4.7.1 Crystal Oscillator Electrical Characteristics
            2. 6.11.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
        5. 6.11.3.5 Internal Oscillators
          1. 6.11.3.5.1 INTOSC Characteristics
      4. 6.11.4  Flash Parameters
      5. 6.11.5  RAM Specifications
      6. 6.11.6  ROM Specifications
      7. 6.11.7  Emulation/JTAG
        1. 6.11.7.1 JTAG Electrical Data and Timing
          1. 6.11.7.1.1 JTAG Timing Requirements
          2. 6.11.7.1.2 JTAG Switching Characteristics
          3. 6.11.7.1.3 JTAG Timing Diagram
        2. 6.11.7.2 cJTAG Electrical Data and Timing
          1. 6.11.7.2.1 cJTAG Timing Requirements
          2. 6.11.7.2.2 cJTAG Switching Characteristics
          3. 6.11.7.2.3 cJTAG Timing Diagram
      8. 6.11.8  GPIO Electrical Data and Timing
        1. 6.11.8.1 GPIO – Output Timing
          1. 6.11.8.1.1 General-Purpose Output Switching Characteristics
        2. 6.11.8.2 GPIO – Input Timing
          1. 6.11.8.2.1 General-Purpose Input Timing Requirements
          2. 6.11.8.2.2 Sampling Mode
        3. 6.11.8.3 Sampling Window Width for Input Signals
      9. 6.11.9  Interrupts
        1. 6.11.9.1 External Interrupt (XINT) Electrical Data and Timing
          1. 6.11.9.1.1 External Interrupt Timing Requirements
          2. 6.11.9.1.2 External Interrupt Switching Characteristics
          3. 6.11.9.1.3 External Interrupt Timing
      10. 6.11.10 Low-Power Modes
        1. 6.11.10.1 Clock-Gating Low-Power Modes
        2. 6.11.10.2 Low-Power Mode Wake-up Timing
          1. 6.11.10.2.1 IDLE Mode Timing Requirements
          2. 6.11.10.2.2 IDLE Mode Switching Characteristics
          3. 6.11.10.2.3 IDLE Entry and Exit Timing Diagram
          4. 6.11.10.2.4 STANDBY Mode Timing Requirements
          5. 6.11.10.2.5 STANDBY Mode Switching Characteristics
          6. 6.11.10.2.6 STANDBY Entry and Exit Timing Diagram
          7. 6.11.10.2.7 HALT Mode Timing Requirements
          8. 6.11.10.2.8 HALT Mode Switching Characteristics
          9. 6.11.10.2.9 HALT Entry and Exit Timing Diagram
    13. 6.12 Analog Peripherals
      1. 6.12.1 Analog Pins and Internal Connections
      2. 6.12.2 Analog Signal Descriptions
      3. 6.12.3 Analog-to-Digital Converter (ADC)
        1. 6.12.3.1 ADC Configurability
          1. 6.12.3.1.1 Signal Mode
        2. 6.12.3.2 ADC Electrical Data and Timing
          1. 6.12.3.2.1 ADC Operating Conditions
          2. 6.12.3.2.2 ADC Characteristics
          3. 6.12.3.2.3 ADC INL and DNL
          4. 6.12.3.2.4 ADC Input Model
          5. 6.12.3.2.5 ADC Timing Diagrams
      4. 6.12.4 Temperature Sensor
        1. 6.12.4.1 Temperature Sensor Electrical Data and Timing
          1. 6.12.4.1.1 Temperature Sensor Characteristics
      5. 6.12.5 Comparator Subsystem (CMPSS)
        1. 6.12.5.1 CMPSS Electrical Data and Timing
          1. 6.12.5.1.1 Comparator Electrical Characteristics
          2.        CMPSS Comparator Input Referred Offset and Hysteresis
          3. 6.12.5.1.2 CMPSS DAC Static Electrical Characteristics
          4. 6.12.5.1.3 CMPSS Illustrative Graphs
    14. 6.13 Control Peripherals
      1. 6.13.1 Enhanced Pulse Width Modulator (ePWM)
        1. 6.13.1.1 Control Peripherals Synchronization
        2. 6.13.1.2 ePWM Electrical Data and Timing
          1. 6.13.1.2.1 ePWM Timing Requirements
          2. 6.13.1.2.2 ePWM Switching Characteristics
          3. 6.13.1.2.3 Trip-Zone Input Timing
            1. 6.13.1.2.3.1 Trip-Zone Input Timing Requirements
        3. 6.13.1.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. 6.13.1.3.1 External ADC Start-of-Conversion Switching Characteristics
      2. 6.13.2 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.13.2.1 HRPWM Electrical Data and Timing
          1. 6.13.2.1.1 High-Resolution PWM Characteristics
      3. 6.13.3 Enhanced Capture and High-Resolution Capture (eCAP, HRCAP)
        1. 6.13.3.1 High-Resolution Capture (HRCAP)
        2. 6.13.3.2 eCAP and HRCAP Block Diagram
        3. 6.13.3.3 eCAP/HRCAP Synchronization
        4. 6.13.3.4 eCAP Electrical Data and Timing
          1. 6.13.3.4.1 eCAP Timing Requirements
          2. 6.13.3.4.2 eCAP Switching Characteristics
        5. 6.13.3.5 HRCAP Electrical Data and Timing
          1. 6.13.3.5.1 HRCAP Switching Characteristics
          2. 6.13.3.5.2 HRCAP Figure and Graph
      4. 6.13.4 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.13.4.1 eQEP Electrical Data and Timing
          1. 6.13.4.1.1 eQEP Timing Requirements
          2. 6.13.4.1.2 eQEP Switching Characteristics
    15. 6.14 Communications Peripherals
      1. 6.14.1 Controller Area Network (CAN)
      2. 6.14.2 Inter-Integrated Circuit (I2C)
        1. 6.14.2.1 I2C Electrical Data and Timing
          1. 6.14.2.1.1 I2C Timing Requirements
          2. 6.14.2.1.2 I2C Switching Characteristics
          3. 6.14.2.1.3 I2C Timing Diagram
      3. 6.14.3 Power Management Bus (PMBus) Interface
        1. 6.14.3.1 PMBus Electrical Data and Timing
          1. 6.14.3.1.1 PMBus Electrical Characteristics
          2. 6.14.3.1.2 PMBus Fast Mode Switching Characteristics
          3. 6.14.3.1.3 PMBus Standard Mode Switching Characteristics
      4. 6.14.4 Serial Communications Interface (SCI)
      5. 6.14.5 Serial Peripheral Interface (SPI)
        1. 6.14.5.1 SPI Master Mode Timings
          1. 6.14.5.1.1 SPI Master Mode Timing Requirements
          2. 6.14.5.1.2 SPI Master Mode Switching Characteristics (Clock Phase = 0)
          3. 6.14.5.1.3 SPI Master Mode Switching Characteristics (Clock Phase = 1)
          4. 6.14.5.1.4 SPI Master Mode Timing Diagrams
        2. 6.14.5.2 SPI Slave Mode Timings
          1. 6.14.5.2.1 SPI Slave Mode Timing Requirements
          2. 6.14.5.2.2 SPI Slave Mode Switching Characteristics
          3. 6.14.5.2.3 SPI Slave Mode Timing Diagrams
      6. 6.14.6 Local Interconnect Network (LIN)
      7. 6.14.7 Fast Serial Interface (FSI)
        1. 6.14.7.1 FSI Transmitter
          1. 6.14.7.1.1 FSITX Electrical Data and Timing
            1. 6.14.7.1.1.1 FSITX Switching Characteristics
            2. 6.14.7.1.1.2 FSITX Timings
        2. 6.14.7.2 FSI Receiver
          1. 6.14.7.2.1 FSIRX Electrical Data and Timing
            1. 6.14.7.2.1.1 FSIRX Timing Requirements
            2. 6.14.7.2.1.2 FSIRX Switching Characteristics
            3. 6.14.7.2.1.3 FSIRX Timings
        3. 6.14.7.3 FSI SPI Compatibility Mode
          1. 6.14.7.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 6.14.7.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 6.14.7.3.1.2 FSITX SPI Signaling Mode Timings
      8. 6.14.8 Host Interface Controller (HIC)
        1. 6.14.8.1 HIC Electrical Data and Timing
          1. 6.14.8.1.1 HIC Timing Requirements
          2. 6.14.8.1.2 HIC Switching Characteristics
          3. 6.14.8.1.3 HIC Timing Diagrams
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Memory
      1. 7.3.1 Memory Map
        1. 7.3.1.1 Dedicated RAM (Mx RAM)
        2. 7.3.1.2 Local Shared RAM (LSx RAM)
        3. 7.3.1.3 Global Shared RAM (GSx RAM)
      2. 7.3.2 Flash Memory Map
        1. 7.3.2.1 Addresses of Flash Sectors
      3. 7.3.3 Peripheral Registers Memory Map
    4. 7.4  Identification
    5. 7.5  Bus Architecture – Peripheral Connectivity
    6. 7.6  C28x Processor
      1. 7.6.1 Floating-Point Unit (FPU)
      2. 7.6.2 Fast Integer Division Unit
      3. 7.6.3 Trigonometric Math Unit (TMU)
      4. 7.6.4 VCRC Unit
    7. 7.7  Embedded Real-Time Analysis and Diagnostic (ERAD)
    8. 7.8  Background CRC-32 (BGCRC)
    9. 7.9  Direct Memory Access (DMA)
    10. 7.10 Device Boot Modes
      1. 7.10.1 Device Boot Configurations
        1. 7.10.1.1 Configuring Boot Mode Pins
        2. 7.10.1.2 Configuring Boot Mode Table Options
      2. 7.10.2 GPIO Assignments
    11. 7.11 Dual Code Security Module
    12. 7.12 Watchdog
    13. 7.13 C28x Timers
    14. 7.14 Dual-Clock Comparator (DCC)
      1. 7.14.1 Features
      2. 7.14.2 Mapping of DCCx (DCC0 and DCC1) Clock Source Inputs
    15. 7.15 Configurable Logic Block (CLB)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Key Device Features
    2. 8.2 Application Information
      1. 8.2.1 Typical Application
        1. 8.2.1.1 Servo Drive Control Module
          1. 8.2.1.1.1 System Block Diagram
          2. 8.2.1.1.2 Servo Drive Control Module Resources
        2. 8.2.1.2 Server or Telecom Power Supply Unit (PSU)
          1. 8.2.1.2.1 System Block Diagram
          2. 8.2.1.2.2 Server and Telecom PSU Resources
        3. 8.2.1.3 Merchant Telecom Rectifiers
          1. 8.2.1.3.1 System Block Diagram
          2. 8.2.1.3.2 Merchant Telecom Rectifiers Resources
        4. 8.2.1.4 EV Charging Station Power Module
          1. 8.2.1.4.1 System Block Diagram
          2. 8.2.1.4.2 EV Charging Station Power Module Resources
        5. 8.2.1.5 Air-conditioner Outdoor Unit
          1. 8.2.1.5.1 System Block Diagram
          2. 8.2.1.5.2 Air Conditioner Outdoor Unit Resources
  10. 9 Device and Documentation Support
    1. 9.1 Getting Started and Next Steps
    2. 9.2 Device and Development Support Tool Nomenclature
    3. 9.3 Markings
    4. 9.4 Tools and Software
    5. 9.5 Documentation Support
    6. 9.6 Support Resources
    7. 9.7 Trademarks
    8. 9.8 Electrostatic Discharge Caution
    9. 9.9 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.1.3.2 Merchant Telecom Rectifiers Resources

Reference Designs and Associated Training Videos

PMP41081 1-kW, 12-V HHC LLC reference design using C2000™ real-time microcontroller
This reference design is a 1-kW, 400-V to 12-V half-bridge resonant DC/DC platform used to evaluate the load transient performance of hybrid-hysteretic control (HHC) with a C2000™ microcontroller.

3-kW phase-shifted full bridge with active clamp reference design with > 270-W/in3 power density
This reference design is a GaN-based 3-kW phase-shifted full bridge (PSFB) targeting maximum power density. The design has an active clamp to minimize voltage stress on the secondary synchronous rectifier MOSFETs enabling use of lower voltage-rating MOSFETs with better figure-of-merit (FoM). PMP23126 uses our 30mΩ GaN on the primary side and silicon MOSFETs on the secondary side. The LMG3522 top-side cooled GaN with integrated driver and protection enables higher efficiency by maintaining ZVS over a wider range of operation compared to Si MOSFET. The PSFB operates at 100 kHz and achieves a peak efficiency of 97.74%.

PMP23069 3.6-kW single-phase totem-pole bridgeless PFC reference design with a > 180-W/in³ power density
This reference design is a GaN-based 3.6-kW single-phase continuous conduction mode (CCM) totem-pole power factor correction (PFC) converter targeting maximum power density. The power stage is followed by a small boost converter, which helps to reduce the size of the bulk capacitor. The LMG3522 top-side cooled GaN with integrated driver and protection enables higher efficiency and reduces power supply size and complexity. The F28004x or F28002x C2000™ controller is used for all the advanced controls that includes fast relay control; baby boost operation during AC dropout event; reverse-current-flow protection; and communication between the PFC and the housekeeping controller. The PFC operates at a switching frequency of 65 kHz and achieves peak efficiency of 98.7%.

PMP41017 3kW two-phase interleaved half-bridge LLC reference design with GaN and C2000™ MCU
This reference design is a 3-kW, two-phase, interleaved half-bridge inductor-inductor-capacitor (LLC) using the LMG3422 and C2000™ devices.

Digitally Controlled High Efficiency and High Power Density PFC Circuits - Part 2 (Video)
This presentation will introduce two bridgeless PFC designs using C2000 MCU. TI high voltage GaN is used to implement a 3.3kW interleaved CCM totem-pole PFC and a 1.6kW interleaved TRM totem-pole PFC designs. Detailed design considerations are provided to minimize switching loss, current crossover distortion, input current THD and improve efficiency and PF.

TIDA-010062 1-kW, 80 Plus titanium, GaN CCM totem pole bridgeless PFC and half-bridge LLC reference design
This reference design is a digitally controlled, compact 1-kW AC/DC power supply design for server power supply unit (PSU) and telecom rectifier applications. The highly efficient design supports two main power stages, including a front-end continuous conduction mode (CCM) totem-pole bridgeless power factor correction (PFC) stage. The PFC stage features an LMG341x GaN FET with integrated driver to provide enhanced efficiency across a wide load range and meet 80-plus titanium requirements. The design also supports a half-bridge LLC isolated DC/DC stage to achieve a +12-V DC output at 1-kW. Two control cards use C2000™ Entry-Performance MCUs to control both power stages.

TIDM-1007 Interleaved CCM Totem Pole PFC Reference Design (Video)
This video covers the hardware aspects, the control aspects, and the software design that are required to control a totem-pole PFC using a C2000 microcontroller. The test results achieved on this reference design are also presented as part of this presentation.

Variable-frequency, ZVS, 5-kW, GaN-based, two-phase totem-pole PFC reference design
This reference design is a high-density and high-efficiency 5-kW totem-pole power factor correction (PFC) design. The design uses a two-phase totem-pole PFC operating with variable frequency and zero voltage switching (ZVS). The control uses a new topology and improved triangular current mode (iTCM) to achieve both small size and high efficiency. The design uses a high performance processing core inside a TMS320F280049C microcontroller to maintain efficiency over a wide operating range. The PFC operates with variable frequency between 100 kHz and 800 kHz. A peak system efficiency of 99% was achieved with an open-frame power density of 120 W/in3.