SPRS584Q April   2009  – January 2024 TMS320F28030 , TMS320F28030-Q1 , TMS320F28031 , TMS320F28031-Q1 , TMS320F28032 , TMS320F28032-Q1 , TMS320F28033 , TMS320F28033-Q1 , TMS320F28034 , TMS320F28034-Q1 , TMS320F28035 , TMS320F28035-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Signal Descriptions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Automotive
    3. 6.3  ESD Ratings – Commercial
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Consumption Summary
      1. 6.5.1 TMS320F2803x Current Consumption at 60-MHz SYSCLKOUT
      2. 6.5.2 Reducing Current Consumption
      3. 6.5.3 Current Consumption Graphs (VREG Enabled)
    6. 6.6  Electrical Characteristics
    7. 6.7  Thermal Resistance Characteristics
      1. 6.7.1 PN Package
      2. 6.7.2 PAG Package
      3. 6.7.3 RSH Package
    8. 6.8  Thermal Design Considerations
    9. 6.9  JTAG Debug Probe Connection Without Signal Buffering for the MCU
    10. 6.10 Parameter Information
      1. 6.10.1 Timing Parameter Symbology
      2. 6.10.2 General Notes on Timing Parameters
    11. 6.11 Test Load Circuit
    12. 6.12 Power Sequencing
      1. 6.12.1 Reset ( XRS) Timing Requirements
      2. 6.12.2 Reset ( XRS) Switching Characteristics
    13. 6.13 Clock Specifications
      1. 6.13.1 Device Clock Table
        1. 6.13.1.1 2803x Clock Table and Nomenclature (60-MHz Devices)
        2. 6.13.1.2 Device Clocking Requirements/Characteristics
        3. 6.13.1.3 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 6.13.2 Clock Requirements and Characteristics
        1. 6.13.2.1 XCLKIN Timing Requirements – PLL Enabled
        2. 6.13.2.2 XCLKIN Timing Requirements – PLL Disabled
        3. 6.13.2.3 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 6.14 Flash Timing
      1. 6.14.1 Flash/OTP Endurance for T Temperature Material
      2. 6.14.2 Flash/OTP Endurance for S Temperature Material
      3. 6.14.3 Flash/OTP Endurance for Q Temperature Material
      4. 6.14.4 Flash Parameters at 60-MHz SYSCLKOUT
      5. 6.14.5 Flash/OTP Access Timing
      6. 6.14.6 Flash Data Retention Duration
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  CPU
      2. 7.1.2  Control Law Accelerator (CLA)
      3. 7.1.3  Memory Bus (Harvard Bus Architecture)
      4. 7.1.4  Peripheral Bus
      5. 7.1.5  Real-Time JTAG and Analysis
      6. 7.1.6  Flash
      7. 7.1.7  M0, M1 SARAMs
      8. 7.1.8  L0 SARAM, and L1, L2, and L3 DPSARAMs
      9. 7.1.9  Boot ROM
        1. 7.1.9.1 Emulation Boot
        2. 7.1.9.2 GetMode
        3. 7.1.9.3 Peripheral Pins Used by the Bootloader
      10. 7.1.10 Security
      11. 7.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 7.1.12 External Interrupts (XINT1–XINT3)
      13. 7.1.13 Internal Zero Pin Oscillators, Oscillator, and PLL
      14. 7.1.14 Watchdog
      15. 7.1.15 Peripheral Clocking
      16. 7.1.16 Low-power Modes
      17. 7.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 7.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 7.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 7.1.20 Control Peripherals
      21. 7.1.21 Serial Port Peripherals
    2. 7.2 Memory Maps
    3. 7.3 Register Maps
    4. 7.4 Device Emulation Registers
    5. 7.5 VREG/BOR/POR
      1. 7.5.1 On-chip Voltage Regulator (VREG)
        1. 7.5.1.1 Using the On-chip VREG
        2. 7.5.1.2 Disabling the On-chip VREG
      2. 7.5.2 On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit
    6. 7.6 System Control
      1. 7.6.1 Internal Zero Pin Oscillators
      2. 7.6.2 Crystal Oscillator Option
      3. 7.6.3 PLL-Based Clock Module
      4. 7.6.4 Loss of Input Clock (NMI Watchdog Function)
      5. 7.6.5 CPU Watchdog Module
    7. 7.7 Low-power Modes Block
    8. 7.8 Interrupts
      1. 7.8.1 External Interrupts
        1. 7.8.1.1 External Interrupt Electrical Data/Timing
          1. 7.8.1.1.1 External Interrupt Timing Requirements
          2. 7.8.1.1.2 External Interrupt Switching Characteristics
    9. 7.9 Peripherals
      1. 7.9.1  Control Law Accelerator (CLA) Overview
      2. 7.9.2  Analog Block
        1. 7.9.2.1 Analog-to-Digital Converter (ADC)
          1. 7.9.2.1.1 Features
          2. 7.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. 7.9.2.1.2.1 External ADC Start-of-Conversion Switching Characteristics
          3. 7.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. 7.9.2.1.3.1 ADC Electrical Characteristics
            2. 7.9.2.1.3.2 ADC Power Modes
            3. 7.9.2.1.3.3 Internal Temperature Sensor
              1. 7.9.2.1.3.3.1 Temperature Sensor Coefficient
            4. 7.9.2.1.3.4 ADC Power-Up Control Bit Timing
              1. 7.9.2.1.3.4.1 ADC Power-Up Delays
            5. 7.9.2.1.3.5 ADC Sequential and Simultaneous Timings
        2. 7.9.2.2 ADC MUX
        3. 7.9.2.3 Comparator Block
          1. 7.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. 7.9.2.3.1.1 Electrical Characteristics of the Comparator/DAC
      3. 7.9.3  Detailed Descriptions
      4. 7.9.4  Serial Peripheral Interface (SPI) Module
        1. 7.9.4.1 SPI Master Mode Electrical Data/Timing
          1. 7.9.4.1.1 SPI Master Mode External Timing (Clock Phase = 0)
          2. 7.9.4.1.2 SPI Master Mode External Timing (Clock Phase = 1)
        2. 7.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. 7.9.4.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
          2. 7.9.4.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 7.9.5  Serial Communications Interface (SCI) Module
      6. 7.9.6  Local Interconnect Network (LIN)
      7. 7.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 7.9.8  Inter-Integrated Circuit (I2C)
        1. 7.9.8.1 I2C Electrical Data/Timing
          1. 7.9.8.1.1 I2C Timing Requirements
          2. 7.9.8.1.2 I2C Switching Characteristics
      9. 7.9.9  Enhanced PWM Modules (ePWM1/2/3/4/5/6/7)
        1. 7.9.9.1 ePWM Electrical Data/Timing
          1. 7.9.9.1.1 ePWM Timing Requirements
          2. 7.9.9.1.2 ePWM Switching Characteristics
        2. 7.9.9.2 Trip-Zone Input Timing
          1. 7.9.9.2.1 Trip-Zone Input Timing Requirements
      10. 7.9.10 High-Resolution PWM (HRPWM)
        1. 7.9.10.1 HRPWM Electrical Data/Timing
          1. 7.9.10.1.1 High-Resolution PWM Characteristics
      11. 7.9.11 Enhanced Capture Module (eCAP1)
        1. 7.9.11.1 eCAP Electrical Data/Timing
          1. 7.9.11.1.1 Enhanced Capture (eCAP) Timing Requirement
          2. 7.9.11.1.2 eCAP Switching Characteristics
      12. 7.9.12 High-Resolution Capture (HRCAP) Module
        1. 7.9.12.1 HRCAP Electrical Data/Timing
          1. 7.9.12.1.1 High-Resolution Capture (HRCAP) Timing Requirements
      13. 7.9.13 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 7.9.13.1 eQEP Electrical Data/Timing
          1. 7.9.13.1.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. 7.9.13.1.2 eQEP Switching Characteristics
      14. 7.9.14 JTAG Port
      15. 7.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 7.9.15.1 GPIO Electrical Data/Timing
          1. 7.9.15.1.1 GPIO - Output Timing
            1. 7.9.15.1.1.1 General-Purpose Output Switching Characteristics
          2. 7.9.15.1.2 GPIO - Input Timing
            1. 7.9.15.1.2.1 General-Purpose Input Timing Requirements
          3. 7.9.15.1.3 Sampling Window Width for Input Signals
          4. 7.9.15.1.4 Low-Power Mode Wakeup Timing
            1. 7.9.15.1.4.1 IDLE Mode Timing Requirements
            2. 7.9.15.1.4.2 IDLE Mode Switching Characteristics
            3. 7.9.15.1.4.3 STANDBY Mode Timing Requirements
            4. 7.9.15.1.4.4 STANDBY Mode Switching Characteristics
            5. 7.9.15.1.4.5 HALT Mode Timing Requirements
            6. 7.9.15.1.4.6 HALT Mode Switching Characteristics
  9. 8 Applications, Implementation, and Layout
    1. 8.1 TI Reference Design
  10. 9 Device and Documentation Support
    1. 9.1 Device and Development Support Tool Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High-efficiency 32-bit CPU (TMS320C28x)
    • 60MHz (16.67ns cycle time)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Programmable Control Law Accelerator (CLA)
    • 32-bit floating-point math accelerator
    • Executes code independently of the main CPU
  • Endianness: Little endian
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Low cost for both device and system:
    • Single 3.3V supply
    • No power sequencing requirement
    • Integrated power-on reset and brown-out reset
    • Low power
    • No analog support pins
  • Clocking:
    • Two internal zero-pin oscillators
    • On-chip crystal oscillator and external clock input
    • Watchdog timer module
    • Missing clock detection circuitry
  • Up to 45 individually programmable, multiplexed GPIO pins with input filtering
  • Peripheral Interrupt Expansion (PIE) block that supports all peripheral interrupts
  • Three 32-bit CPU timers
  • Independent 16-bit timer in each Enhanced Pulse Width Modulator (ePWM)
  • On-chip memory
    • Flash, SARAM, OTP, Boot ROM available
  • Code-security module
  • 128-bit security key and lock
    • Protects secure memory blocks
    • Prevents firmware reverse engineering
  • Serial port peripherals
    • One Serial Communications Interface (SCI) Universal Asynchronous Receiver/Transmitter (UART) module
    • Two Serial Peripheral Interface (SPI) modules
    • One Inter-Integrated-Circuit (I2C) module
    • One Local Interconnect Network (LIN) module
    • One Enhanced Controller Area Network (eCAN) module
  • Enhanced control peripherals
    • ePWM
    • High-Resolution PWM (HRPWM)
    • Enhanced Capture (eCAP) module
    • High-Resolution Input Capture (HRCAP) module
    • Enhanced Quadrature Encoder Pulse (eQEP) module
    • Analog-to-Digital Converter (ADC)
    • On-chip temperature sensor
    • Comparator
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug through hardware
  • Package options
    • 56-Pin RSH Very Thin Quad Flatpack (No lead) (VQFN)
    • 64-Pin PAG Thin Quad Flatpack (TQFP)
    • 80-Pin PN Low-Profile Quad Flatpack (LQFP)
  • Temperature options
    • T: –40°C to 105°C
    • S: –40°C to 125°C
    • Q: –40°C to 125°C
      (AEC Q100 qualification for automotive applications)