SPRS357D August   2006  – June 2020 TMS320F28044

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for F28044 100-Ball GGM Package
    7. 5.7  Thermal Resistance Characteristics for F28044 100-Pin PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-3 TMS320x280x Clock Table and Nomenclature
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-5 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-6 Input Clock Frequency
        2. Table 5-7 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-8 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-10 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-11 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-12 IDLE Mode Timing Requirements
            2. Table 5-13 IDLE Mode Switching Characteristics
            3. Table 5-14 STANDBY Mode Timing Requirements
            4. Table 5-15 STANDBY Mode Switching Characteristics
            5. Table 5-16 HALT Mode Timing Requirements
            6. Table 5-17 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-18 ePWM Timing Requirements
            2. Table 5-19 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-20 Trip-Zone input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-21 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz)
          4. 5.9.4.2.4 ADC Start-of-Conversion Timing
            1. Table 5-22 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-23 External Interrupt Timing Requirements
          2. Table 5-24 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-25 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Master Mode Timing
          1. Table 5-26 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-27 SPI Master Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 SPI Slave Mode Timing
          1. Table 5-28 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-29 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.9.5 JTAG Debug Probe Connection Without Signal Buffering for the DSP
      6. 5.9.6 Flash Timing
        1. Table 5-30 Flash Endurance for A Temperature Material
        2. Table 5-31 Flash Parameters at 100-MHz SYSCLKOUT
        3. Table 5-32 Flash/OTP Access Timing
        4. Table 5-33 Flash Data Retention Duration
    10. 5.10 On-Chip Analog-to-Digital Converter
      1. Table 5-35 ADC Electrical Characteristics (over recommended operating conditions)
      2. 5.10.1     ADC Power-Up Control Bit Timing
        1. Table 5-36 ADC Power-Up Delays
        2. Table 5-37 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 5.10.2     Definitions
      4. 5.10.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-38 Sequential Sampling Mode Timing
      5. 5.10.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-39 Simultaneous Sampling Mode Timing
      6. 5.10.5     Detailed Descriptions
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  M0, M1 SARAMs
      7. 6.1.7  L0, L1 SARAMs
      8. 6.1.8  Boot ROM
      9. 6.1.9  Security
      10. 6.1.10 Peripheral Interrupt Expansion (PIE) Block
      11. 6.1.11 External Interrupts (XINT1, XINT2, XNMI)
      12. 6.1.12 Oscillator and PLL
      13. 6.1.13 Watchdog
      14. 6.1.14 Peripheral Clocking
      15. 6.1.15 Low-Power Modes
      16. 6.1.16 Peripheral Frames 0, 1, 2 (PFn)
      17. 6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
      18. 6.1.18 32-Bit CPU-Timers (0, 1, 2)
      19. 6.1.19 Control Peripherals
      20. 6.1.20 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1 32-Bit CPU-Timers 0/1/2
      2. 6.2.2 Enhanced PWM Modules (ePWM1–16)
      3. 6.2.3 Hi-Resolution PWM (HRPWM)
      4. 6.2.4 Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.4.1 ADC Connections if the ADC Is Not Used
        2. 6.2.4.2 ADC Registers
      5. 6.2.5 Serial Communications Interface (SCI) Module (SCI-A)
      6. 6.2.6 Serial Peripheral Interface (SPI) Module (SPI-A)
      7. 6.2.7 Inter-Integrated Circuit (I2C)
      8. 6.2.8 GPIO MUX
    3. 6.3 Memory Map
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PZ|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2.4 Enhanced Analog-to-Digital Converter (ADC) Module

A simplified functional block diagram of the ADC module is shown in Figure 6-5. The ADC module consists of a 12-bit ADC with a built-in sample-and-hold (S/H) circuit. Functions of the ADC module include:

  • 12-bit ADC core with built-in S/H
  • Analog input: 0.0 V to 3.0 V (Voltages above 3.0 V produce full-scale conversion results.)
  • Fast conversion rate: 80 ns at 25-MHz ADC clock, 12.5 MSPS
  • 16-channel, MUXed inputs
  • Autosequencing capability provides up to 16 "autoconversions" in a single session. Each conversion can be programmed to select any 1 of 16 input channels
  • Sequencer can be operated as two independent 8-state sequencers or as one large 16-state sequencer (that is, two cascaded 8-state sequencers)
  • Sixteen result registers (individually addressable) to store conversion values
    • The digital value of the input analog voltage is derived by:
      • TMS320F28044 q_adclo3_prs439.gif
  • Multiple triggers as sources for the start-of-conversion (SOC) sequence
    • S/W - software immediate start
    • ePWM start of conversion
    • XINT2 ADC start of conversion
  • Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS.
  • Sequencer can operate in "start/stop" mode, allowing multiple "time-sequenced triggers" to synchronize conversions.
  • SOCA and SOCB triggers can operate independently in dual-sequencer mode.
  • Sample-and-hold (S/H) acquisition time window has separate prescale control.

The ADC module in the F28044 device has been enhanced to provide flexible interface to ePWM peripherals. The ADC interface is built around a fast, 12-bit ADC module with a fast conversion rate of 80 ns at 25-MHz ADC clock. The ADC module has 16 channels, configurable as two independent 8-channel modules. The two independent 8-channel modules can be cascaded to form a 16-channel module. Although there are multiple input channels and two sequencers, there is only one converter in the ADC module. Figure 6-5 shows the block diagram of the ADC module.

The two 8-channel modules have the capability to autosequence a series of conversions, each module has the choice of selecting any one of the respective eight channels available through an analog MUX. In the cascaded mode, the autosequencer functions as a single 16-channel sequencer. On each sequencer, once the conversion is complete, the selected channel value is stored in its respective RESULT register. Autosequencing allows the system to convert the same channel multiple times, allowing the user to perform oversampling algorithms. This gives increased resolution over traditional single-sampled conversion results.

TMS320F28044 adcmod_prs357.gifFigure 6-5 Block Diagram of the ADC Module

To obtain the specified accuracy of the ADC, proper board layout is very critical. To the best extent possible, traces leading to the ADCIN pins should not run in close proximity to the digital signal paths. This is to minimize switching noise on the digital lines from getting coupled to the ADC inputs. Furthermore, proper isolation techniques must be used to isolate the ADC module power pins (VDD1A18, VDD2A18 , VDDA2, VDDAIO) from the digital supply. Figure 6-6 shows the ADC pin connections for the F28044 device.

NOTE

  1. The ADC registers are accessed at the SYSCLKOUT rate. The internal timing of the ADC module is controlled by the high-speed peripheral clock (HSPCLK).
  2. The behavior of the ADC module based on the state of the ADCENCLK and HALT signals is as follows:
    • ADCENCLK: On reset, this signal will be low. While reset is active-low (XRS) the clock to the register will still function. This is necessary to make sure all registers and modes go into their default reset state. The analog module, however, will be in a low-power inactive state. As soon as reset goes high, then the clock to the registers will be disabled. When the user sets the ADCENCLK signal high, then the clocks to the registers will be enabled and the analog module will be enabled. There will be a certain time delay (ms range) before the ADC is stable and can be used.
    • HALT: This mode only affects the analog module. It does not affect the registers. In this mode, the ADC module goes into low-power mode. This mode also will stop the clock to the CPU, which will stop the HSPCLK; therefore, the ADC register logic will be turned off indirectly.

Figure 6-6 shows the ADC pin-biasing for internal reference and Figure 6-7 shows the ADC pin-biasing for external reference.

TMS320F28044 adcpinint_prs357.gif
A. TAIYO YUDEN LMK212BJ225MG-T or equivalent
B. External decoupling capacitors are recommended on all power pins.
C. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
Figure 6-6 ADC Pin Connections With Internal Reference
TMS320F28044 adcpinext_prs357.gif
A. TAIYO YUDEN LMK212BJ225MG-T or equivalent
B. External decoupling capacitors are recommended on all power pins.
C. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
D. External voltage on ADCREFIN is enabled by changing bits 15:14 in the ADC Reference Select register depending on the voltage used on this pin. TI recommends TI part REF3020 or equivalent for 2.048-V generation. Overall gain accuracy will be determined by accuracy of this voltage source.
Figure 6-7 ADC Pin Connections With External Reference

NOTE

The temperature rating of any recommended component must match the rating of the end product.