SPRS357D August   2006  – June 2020 TMS320F28044

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for F28044 100-Ball GGM Package
    7. 5.7  Thermal Resistance Characteristics for F28044 100-Pin PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-3 TMS320x280x Clock Table and Nomenclature
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-5 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-6 Input Clock Frequency
        2. Table 5-7 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-8 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-10 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-11 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-12 IDLE Mode Timing Requirements
            2. Table 5-13 IDLE Mode Switching Characteristics
            3. Table 5-14 STANDBY Mode Timing Requirements
            4. Table 5-15 STANDBY Mode Switching Characteristics
            5. Table 5-16 HALT Mode Timing Requirements
            6. Table 5-17 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-18 ePWM Timing Requirements
            2. Table 5-19 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-20 Trip-Zone input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-21 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz)
          4. 5.9.4.2.4 ADC Start-of-Conversion Timing
            1. Table 5-22 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-23 External Interrupt Timing Requirements
          2. Table 5-24 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-25 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Master Mode Timing
          1. Table 5-26 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-27 SPI Master Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 SPI Slave Mode Timing
          1. Table 5-28 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-29 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.9.5 JTAG Debug Probe Connection Without Signal Buffering for the DSP
      6. 5.9.6 Flash Timing
        1. Table 5-30 Flash Endurance for A Temperature Material
        2. Table 5-31 Flash Parameters at 100-MHz SYSCLKOUT
        3. Table 5-32 Flash/OTP Access Timing
        4. Table 5-33 Flash Data Retention Duration
    10. 5.10 On-Chip Analog-to-Digital Converter
      1. Table 5-35 ADC Electrical Characteristics (over recommended operating conditions)
      2. 5.10.1     ADC Power-Up Control Bit Timing
        1. Table 5-36 ADC Power-Up Delays
        2. Table 5-37 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 5.10.2     Definitions
      4. 5.10.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-38 Sequential Sampling Mode Timing
      5. 5.10.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-39 Simultaneous Sampling Mode Timing
      6. 5.10.5     Detailed Descriptions
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  M0, M1 SARAMs
      7. 6.1.7  L0, L1 SARAMs
      8. 6.1.8  Boot ROM
      9. 6.1.9  Security
      10. 6.1.10 Peripheral Interrupt Expansion (PIE) Block
      11. 6.1.11 External Interrupts (XINT1, XINT2, XNMI)
      12. 6.1.12 Oscillator and PLL
      13. 6.1.13 Watchdog
      14. 6.1.14 Peripheral Clocking
      15. 6.1.15 Low-Power Modes
      16. 6.1.16 Peripheral Frames 0, 1, 2 (PFn)
      17. 6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
      18. 6.1.18 32-Bit CPU-Timers (0, 1, 2)
      19. 6.1.19 Control Peripherals
      20. 6.1.20 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1 32-Bit CPU-Timers 0/1/2
      2. 6.2.2 Enhanced PWM Modules (ePWM1–16)
      3. 6.2.3 Hi-Resolution PWM (HRPWM)
      4. 6.2.4 Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.4.1 ADC Connections if the ADC Is Not Used
        2. 6.2.4.2 ADC Registers
      5. 6.2.5 Serial Communications Interface (SCI) Module (SCI-A)
      6. 6.2.6 Serial Peripheral Interface (SPI) Module (SPI-A)
      7. 6.2.7 Inter-Integrated Circuit (I2C)
      8. 6.2.8 GPIO MUX
    3. 6.3 Memory Map
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PZ|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6.1.3 Loss of Input Clock

In PLL-enabled and PLL-bypass mode, if the input clock OSCCLK is removed or absent, the PLL will still issue a "limp-mode" clock. The limp-mode clock continues to clock the CPU and peripherals at a typical frequency of 1–5 MHz. Limp mode is not specified to work from power-up, only after input clocks have been present initially. In PLL bypass mode, the limp mode clock from the PLL is automatically routed to the CPU if the input clock is removed or absent.

Normally, when the input clocks are present, the watchdog counter decrements to initiate a watchdog reset or WDINT interrupt. However, when the external input clock fails, the watchdog counter stops decrementing (that is, the watchdog counter does not change with the limp-mode clock). In addition to this, the device will be reset and the “Missing Clock Status” (MCLKSTS) bit will be set. These conditions could be used by the application firmware to detect the input clock failure and initiate necessary shut-down procedure for the system.

NOTE

Applications in which the correct CPU operating frequency is absolutely critical should implement a mechanism by which the DSP will be held in reset, should the input clocks ever fail. For example, an R-C circuit may be used to trigger the XRS pin of the DSP, should the capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from getting fully charged. Such a circuit would also help in detecting failure of the flash memory and the VDD3VFL rail.