SPRS439Q June   2007  – August 2022 TMS320F28232 , TMS320F28232-Q1 , TMS320F28234 , TMS320F28234-Q1 , TMS320F28235 , TMS320F28235-Q1 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335 , TMS320F28335-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Automotive
    3. 7.3  ESD Ratings – Commercial
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 TMS320F28335/F28235 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      2. 7.5.2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      3. 7.5.3 Reducing Current Consumption
      4. 7.5.4 Current Consumption Graphs
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics
      1. 7.7.1 PGF Package
      2. 7.7.2 PTP Package
      3. 7.7.3 ZHH Package
      4. 7.7.4 ZAY Package
      5. 7.7.5 ZJZ Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Timing and Switching Characteristics
      1. 7.9.1 Timing Parameter Symbology
        1. 7.9.1.1 General Notes on Timing Parameters
        2. 7.9.1.2 Test Load Circuit
        3. 7.9.1.3 Device Clock Table
          1. 7.9.1.3.1 Clocking and Nomenclature (150-MHz Devices)
          2. 7.9.1.3.2 Clocking and Nomenclature (100-MHz Devices)
      2. 7.9.2 Power Sequencing
        1. 7.9.2.1 Power Management and Supervisory Circuit Solutions
        2. 7.9.2.2 Reset (XRS) Timing Requirements
      3. 7.9.3 Clock Requirements and Characteristics
        1. 7.9.3.1 Input Clock Frequency
        2. 7.9.3.2 XCLKIN Timing Requirements – PLL Enabled
        3. 7.9.3.3 XCLKIN Timing Requirements – PLL Disabled
        4. 7.9.3.4 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        5. 7.9.3.5 Timing Diagram
      4. 7.9.4 Peripherals
        1. 7.9.4.1 General-Purpose Input/Output (GPIO)
          1. 7.9.4.1.1 GPIO - Output Timing
            1. 7.9.4.1.1.1 General-Purpose Output Switching Characteristics
          2. 7.9.4.1.2 GPIO - Input Timing
            1. 7.9.4.1.2.1 General-Purpose Input Timing Requirements
          3. 7.9.4.1.3 Sampling Window Width for Input Signals
          4. 7.9.4.1.4 Low-Power Mode Wakeup Timing
            1. 7.9.4.1.4.1 IDLE Mode Timing Requirements
            2. 7.9.4.1.4.2 IDLE Mode Switching Characteristics
            3. 7.9.4.1.4.3 IDLE Mode Timing Diagram
            4. 7.9.4.1.4.4 STANDBY Mode Timing Requirements
            5. 7.9.4.1.4.5 STANDBY Mode Switching Characteristics
            6. 7.9.4.1.4.6 STANDBY Mode Timing Diagram
            7. 7.9.4.1.4.7 HALT Mode Timing Requirements
            8. 7.9.4.1.4.8 HALT Mode Switching Characteristics
            9. 7.9.4.1.4.9 HALT Mode Timing Diagram
        2. 7.9.4.2 Enhanced Control Peripherals
          1. 7.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. 7.9.4.2.1.1 ePWM Timing Requirements
            2. 7.9.4.2.1.2 ePWM Switching Characteristics
          2. 7.9.4.2.2 Trip-Zone Input Timing
            1. 7.9.4.2.2.1 Trip-Zone Input Timing Requirements
          3. 7.9.4.2.3 High-Resolution PWM Timing
            1. 7.9.4.2.3.1 High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)
          4. 7.9.4.2.4 Enhanced Capture (eCAP) Timing
            1. 7.9.4.2.4.1 Enhanced Capture (eCAP) Timing Requirements
            2. 7.9.4.2.4.2 eCAP Switching Characteristics
          5. 7.9.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. 7.9.4.2.5.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. 7.9.4.2.5.2 eQEP Switching Characteristics
          6. 7.9.4.2.6 ADC Start-of-Conversion Timing
            1. 7.9.4.2.6.1 External ADC Start-of-Conversion Switching Characteristics
            2. 7.9.4.2.6.2 ADCSOCAO or ADCSOCBO Timing
        3. 7.9.4.3 External Interrupt Timing
          1. 7.9.4.3.1 External Interrupt Timing Requirements
          2. 7.9.4.3.2 External Interrupt Switching Characteristics
          3. 7.9.4.3.3 External Interrupt Timing Diagram
        4. 7.9.4.4 I2C Electrical Specification and Timing
          1. 7.9.4.4.1 I2C Timing
        5. 7.9.4.5 Serial Peripheral Interface (SPI) Timing
          1. 7.9.4.5.1 Master Mode Timing
            1. 7.9.4.5.1.1 SPI Master Mode External Timing (Clock Phase = 0)
            2. 7.9.4.5.1.2 SPI Master Mode External Timing (Clock Phase = 1)
          2. 7.9.4.5.2 Slave Mode Timing
            1. 7.9.4.5.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
            2. 7.9.4.5.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
        6. 7.9.4.6 Multichannel Buffered Serial Port (McBSP) Timing
          1. 7.9.4.6.1 McBSP Transmit and Receive Timing
            1. 7.9.4.6.1.1 McBSP Timing Requirements
            2. 7.9.4.6.1.2 McBSP Switching Characteristics
          2. 7.9.4.6.2 McBSP as SPI Master or Slave Timing
            1. 7.9.4.6.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 7.9.4.6.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. 7.9.4.6.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. 7.9.4.6.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. 7.9.4.6.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. 7.9.4.6.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. 7.9.4.6.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. 7.9.4.6.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      5. 7.9.5 JTAG Debug Probe Connection Without Signal Buffering for the MCU
      6. 7.9.6 External Interface (XINTF) Timing
        1. 7.9.6.1 USEREADY = 0
        2. 7.9.6.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
        3. 7.9.6.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
        4. 7.9.6.4 XINTF Signal Alignment to XCLKOUT
        5. 7.9.6.5 External Interface Read Timing
          1. 7.9.6.5.1 External Interface Read Timing Requirements
          2. 7.9.6.5.2 External Interface Read Switching Characteristics
        6. 7.9.6.6 External Interface Write Timing
          1. 7.9.6.6.1 External Interface Write Switching Characteristics
        7. 7.9.6.7 External Interface Ready-on-Read Timing With One External Wait State
          1. 7.9.6.7.1 External Interface Read Switching Characteristics (Ready-on-Read, One Wait State)
          2. 7.9.6.7.2 External Interface Read Timing Requirements (Ready-on-Read, One Wait State)
          3. 7.9.6.7.3 Synchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
          4. 7.9.6.7.4 Asynchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
        8. 7.9.6.8 External Interface Ready-on-Write Timing With One External Wait State
          1. 7.9.6.8.1 External Interface Write Switching Characteristics (Ready-on-Write, One Wait State)
          2. 7.9.6.8.2 Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
          3. 7.9.6.8.3 Asynchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
        9. 7.9.6.9 XHOLD and XHOLDA Timing
          1. 7.9.6.9.1 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = XTIMCLK)
          2. 7.9.6.9.2 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
      7. 7.9.7 Flash Timing
        1. 7.9.7.1 Flash Endurance for A and S Temperature Material
        2. 7.9.7.2 Flash Endurance for Q Temperature Material
        3. 7.9.7.3 Flash Parameters at 150-MHz SYSCLKOUT
        4. 7.9.7.4 Flash/OTP Access Timing
        5. 7.9.7.5 Flash Data Retention Duration
    10. 7.10 On-Chip Analog-to-Digital Converter
      1. 7.10.1 ADC Electrical Characteristics (over recommended operating conditions)
      2. 7.10.2 ADC Power-Up Control Bit Timing
        1. 7.10.2.1 ADC Power-Up Delays
        2. 7.10.2.2 Typical Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 7.10.3 Definitions
      4. 7.10.4 Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. 7.10.4.1 Sequential Sampling Mode Timing
      5. 7.10.5 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. 7.10.5.1 Simultaneous Sampling Mode Timing
      6. 7.10.6 Detailed Descriptions
    11. 7.11 Migrating Between F2833x Devices and F2823x Devices
  8. 8 Detailed Description
    1. 8.1 Brief Descriptions
      1. 8.1.1  C28x CPU
      2. 8.1.2  Memory Bus (Harvard Bus Architecture)
      3. 8.1.3  Peripheral Bus
      4. 8.1.4  Real-Time JTAG and Analysis
      5. 8.1.5  External Interface (XINTF)
      6. 8.1.6  Flash
      7. 8.1.7  M0, M1 SARAMs
      8. 8.1.8  L0, L1, L2, L3, L4, L5, L6, L7 SARAMs
      9. 8.1.9  Boot ROM
        1. 8.1.9.1 Peripheral Pins Used by the Bootloader
      10. 8.1.10 Security
      11. 8.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 8.1.12 External Interrupts (XINT1–XINT7, XNMI)
      13. 8.1.13 Oscillator and PLL
      14. 8.1.14 Watchdog
      15. 8.1.15 Peripheral Clocking
      16. 8.1.16 Low-Power Modes
      17. 8.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 8.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 8.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 8.1.20 Control Peripherals
      21. 8.1.21 Serial Port Peripherals
    2. 8.2 Peripherals
      1. 8.2.1  DMA Overview
      2. 8.2.2  32-Bit CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
      3. 8.2.3  Enhanced PWM Modules
      4. 8.2.4  High-Resolution PWM (HRPWM)
      5. 8.2.5  Enhanced CAP Modules
      6. 8.2.6  Enhanced QEP Modules
      7. 8.2.7  Analog-to-Digital Converter (ADC) Module
        1. 8.2.7.1 ADC Connections if the ADC Is Not Used
        2. 8.2.7.2 ADC Registers
        3. 8.2.7.3 ADC Calibration
      8. 8.2.8  Multichannel Buffered Serial Port (McBSP) Module
      9. 8.2.9  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      10. 8.2.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
      11. 8.2.11 Serial Peripheral Interface (SPI) Module (SPI-A)
      12. 8.2.12 Inter-Integrated Circuit (I2C)
      13. 8.2.13 GPIO MUX
      14. 8.2.14 External Interface (XINTF)
    3. 8.3 Memory Maps
    4. 8.4 Register Map
      1. 8.4.1 Device Emulation Registers
    5. 8.5 Interrupts
      1. 8.5.1 External Interrupts
    6. 8.6 System Control
      1. 8.6.1 OSC and PLL Block
        1. 8.6.1.1 External Reference Oscillator Clock Option
        2. 8.6.1.2 PLL-Based Clock Module
        3. 8.6.1.3 Loss of Input Clock
      2. 8.6.2 Watchdog Block
    7. 8.7 Low-Power Modes Block
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device and Development Support Tool Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Redesign Details
    2. 11.2 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZJZ|176
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.10.1 ADC Electrical Characteristics (over recommended operating conditions)

PARAMETER(1)(2)MINTYPMAXUNIT
DC SPECIFICATIONS(3)
Resolution12Bits
ADC clock0.00125MHz
ACCURACY
INL (Integral nonlinearity)1-12.5 MHz ADC clock (6.25 MSPS)±1.5LSB
12.5-25 MHz ADC clock (12.5 MSPS)±2LSB
DNL (Differential nonlinearity)(4)±1LSB
Offset error(5)(3)–1515LSB
Overall gain error with internal reference(6)(3)–3030LSB
Overall gain error with external reference(3)–3030LSB
Channel-to-channel offset variation±4LSB
Channel-to-channel gain variation±4LSB
ANALOG INPUT
Analog input voltage (ADCINx to ADCLO)(7)03V
ADCLO–505mV
Input capacitance10pF
Input leakage current±5μA
INTERNAL VOLTAGE REFERENCE(6)
VADCREFP - ADCREFP output voltage at the pin based on internal reference1.275V
VADCREFM - ADCREFM output voltage at the pin based on internal reference0.525V
Voltage difference, ADCREFP - ADCREFM0.75V
Temperature coefficient50PPM/°C
EXTERNAL VOLTAGE REFERENCE(6)(8)
VADCREFIN - External reference voltage input on ADCREFIN pin 0.2% or better accurate reference recommendedADCREFSEL[15:14] = 11b1.024V
ADCREFSEL[15:14] = 10b1.500V
ADCREFSEL[15:14] = 01b2.048V
AC SPECIFICATIONS
SINAD (100 kHz) Signal-to-noise ratio + distortion67.5dB
SNR (100 kHz) Signal-to-noise ratio68dB
THD (100 kHz) Total harmonic distortion–79dB
ENOB (100 kHz) Effective number of bits10.9Bits
SFDR (100 kHz) Spurious free dynamic range83dB
(1) Tested at 25 MHz ADCCLK.
(2) All voltages listed in this table are with respect to VSSA2.
(3) ADC parameters for gain error and offset error are only specified if the ADC calibration routine is executed from the Boot ROM. See Section 8.2.7.3 for more information.
(4) TI specifies that the ADC will have no missing codes.
(5) 1 LSB has the weighted value of 3.0/4096 = 0.732 mV.
(6) A single internal/external band gap reference sources both ADCREFP and ADCREFM signals, and hence, these voltages track together. The ADC converter uses the difference between these two as its reference. The total gain error listed for the internal reference is inclusive of the movement of the internal band gap over temperature. Gain error over temperature for the external reference option will depend on the temperature profile of the source used.
(7) Voltages above VDDA + 0.3 V or below VSS - 0.3 V applied to an analog input pin may temporarily affect the conversion of another pin. To avoid this, the analog inputs should be kept within these limits.
(8) TI recommends using high precision external reference TI part REF3020/3120 or equivalent for 2.048-V reference.